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Abstracts for Technology Innovation Forum 2017


 

Session Chair

Ms. Meenu SARIN

Company

VLSI Consultancy, Singapore

Designation

Director

Profile

Meenu Sarin value-adds to her clients through her company, VLSI Consultancy, by helping them address their various challenges and issues in the techno-commercial space in the semiconductor eco-system. She broadly focuses on 3 main facets – Talent Development, Strategic planning and Technology/Product roadmap planning, and Program Management & Solution Consulting. Her clients include companies across the semiconductor value chain and from geographies including Singapore, Malaysia, Hong Kong, India, US and Brazil.

Meenu is also engaged with Singapore’s premiere statutory R&D agency A*STAR as a Program Consultant. Being a strong industry advocate, she is a founding member and an Honorary Executive Committee Member of the Singapore Semiconductor Industry Association (www.ssia.org.sg).

Some of her industry initiatives under this include Singapore Semiconductor Vision 2020 including Public-Private-Partnership, Mentorship program for engaging students to be a part of the semiconductor industry, Overseas Industry delegations etc. besides her speaking, sessions’ chairing, panellist, moderator for panel discussions engagements in various Thought Leadership Forums. She is also active on the digital media platform with substantial contributions in terms of articles, analysis, feedbacks and market reports, news articles, interviews, blogs etc. to online news sites in the semiconductor space including EE Times and EEWeb.

Meenu’s experience of over 26 years in the semiconductor industry spans across various facets of operations & across geographies like Europe, India, Singapore, Greater China and Australia. Prior to starting VLSI Consultancy, Meenu was a Technical Marketing Manager in STMicroelectronics (STM)/Singapore with focus on Telecom segment. In this role, she was responsible for Business Development and Program Management for STM's semicustom ASIC projects in Asia Pacific. She also worked as a Program Manager in charge of managing various semi-custom projects with customers in the Asia-Pacific Region. Before her move to STM Singapore, Meenu worked at STM India. As a Design Manager for Library Design Group, she was responsible for starting up and managing a 30 member team involved in design and development of semi-custom digital libraries in various technologies across different platforms as per the market requirements, and to support designers in STM's worldwide locations. Prior to this, Meenu worked as a Design Engineer for digital library design and development at STM Italy for several years after receiving her engineering degree (Computer Engineering) from Delhi Institute of Technology, India in 1988.
 


 

Invited Speaker & Panelist

Mr. YAP Ah Choi

Company

GLOBALFOUNDRIES Singapore Pte Ltd, Singapore

Designation

Manager, Automation Engineering

Title of Presentation

Transforming 200mm Fabs Through Automation

Abstract

While the growing market trend is driving for the need for Advanced Manufacturing in the 300mm wafer fabs, what is the outlook of the matured 200mm fabs?  Do these fabs have a part to play in the Industry4.0 era?  Through the sharing of GLOBALFOUNDRIES' SMART manufacturing strategies deployed at Singapore Site’s 200mm fabs, this talk aims to give insights on how the adoption of Automation and IoT solutions extends the effectiveness and profitability of the matured fabs and how it has helped the fabs transform from a predominantly manual operations environment to a highly automated one that has enable it to become one of the world's top wafer foundry.
 

Profile

Yap Ah Choi, or simply Yap is an enthusiastic automation professional at GlobalFoundries Singapore, an innovator and technology admirer that helps companies to bring in new concept of automation and exciting innovation to improve productivity. With the strong automation mindset, Yap has then successfully implemented many systems that improved cost and task simplification. Previously, Yap worked as a Manufacturing Manager for local and MNC semiconductor manufacturer in both frontend and backend operation. This vast knowledge has set Yap with strong background on his today accomplishment. He graduated with honors from Queensland University of Technology with a degree in Electrical Engineering.
 


 

Invited Speaker & Panelist

Mr. Teck LEE

Company

ASE Group, Taiwan

Designation

Senior Technical Manager, Corporate R&D

Title of Presentation

A Highly Integrated and Comprehensive SiP Solutions for IoT

Abstract

From an assembly packaging point of view, what are the opportunities and what kind of packaging solutions and services that can be offered to capture the growing market of IoT.
 

Profile

Teck Lee is a Senior Technical Manager, from Corporate R&D of ASE Group based in Kaohsiung, Taiwan. He has over 17 years of experience in the field of packaging and also was in charge of various technical positions, which include Bumping process & integration, and product teams, Group Technology Integration, Glass IPD development, and most recently focus on the advanced wafer interconnect development for the next generation RF SiP solution. He has a B.S. and M.S. degree from Southern Illinois University at Carbondale.
 


 

Invited Speaker & Panelist

Mr. Ranjan CHATTERJEE

Company

Cimetrix, USA

Designation

Vice President, Emerging Business & Technology Office

Title of Presentation

Implementing IIoT using SEMI Standards – A Platform Based Approach

Abstract

Increased digitization of the manufacturing sector is leading to increased integration of sensors for turning data into actionable insight using big data analytics tools. A platform based IIOT factory analytics architecture can help factories collect and mine their vast stores of data into knowledge by providing the detailed, practical insights needed to identify solutions. These platform based tools help managers implement their programs more quickly and efficiently, with some companies capturing improvements in costs, throughput, and quality within weeks. For many, IIoT means that after a plant has attached all of their manufacturing equipment, they come to the conclusion that data analysis begets more data analysis and they want to start adding sensors — everywhere. These sensors include coolant, vibration, temperature, humidity, motion, current and amperage. These sensors come into play after shops have connected to their major assets, such as machine tools and operators. This attention on connecting everything in manufacturing underscores the importance of interoperability, the first design principle of IIOT. A platform based architecture could easily integrate machines with sensors to record important events that affect OEE, including production slowdowns or equipment malfunctions. Operators would then use a touchscreen interface to enter contextual information, reducing the time spent on manual data input and providing engineers with a richer level of detail. These tools first analyze historical information and conduct automated data analyses to identify the root cause of problems. They then suggest solutions or automatically execute them. A platform is not just the operating system, but it is also the rules of the road in terms of interoperability between systems, security, licensing, interfaces, reference implementations, working groups and countless other critical aspects of a platform. Building a platform that becomes an industry standard is extremely difficult and expensive.
 

Profile

Ranjan Chatterjee is Vice President, Emerging Business and Technology Office at Cimetrix. His focus is on extending and introducing standards into Industry 4.0 and Industrial Internet of Things (IIoT) initiatives by interfacing manufacturing equipment with big data and embedded analytics tools.

Ranjan has over three decades of experience in development and deployment of a standards-based factory control system for SMT and assembly, which encompassed multiple factories around the world, and connected thousands of pieces of equipment.

Ranjan lead a global software business and development team. He has developed software using big data tools, cloud computing platforms, process control, and lean manufacturing. Ranjan has a M.S. in Computer Science from Carnegie Mellon University.
 


 

Invited Speaker & Panelist

Dr. Thomas OOI

Company

Intel, Malaysia

Designation

Solution Enabling Manager

Title of Presentation

Opportunities and Challenges in End-to-End IoT Deployment

Abstract

The growth of Internet of Things (IOT) is accelerating and it presents a huge opportunity for the electronics industry. Along with the opportunities, there are technical and business challenges that need to be addressed before the full benefits of end-end deployment of internet of things can be realized.
 

Profile

 

Thomas Ooi, Currently served as Solution Enabling Manager in IOT Group, has 19 years of practical experience in business management, technical services, product development and deployment, and program management etc in both services and product industry. He has been involved deeply in Industrial, Energy, Medical, Gaming, Transportation and Telco industry over his career as a technologist.  Currently he led a team focusing on industrial and Energy, Smart Building, Logistics, Smart Home, Smart Lighting, Agriculture and Medical business for Intel Internet of Things Group supporting Asia business opportunities.  Thomas holds a bachelor degree in Computer Science, MBA and Doctorate in Business Management. At his free time, he taught in private university in the areas of Quantitative Techniques, Research Methodology, and Project Management.
 


 

Invited Speaker & Panelist

Dr. David HAYNES

Company

Lam Research Corporation, USA

Designation

Senior Director, Business Development, IoT Solutions in the MEMS and Advanced Packaging business group

Title of Presentation

Enhancing Capital Efficiency and Fab Productivity for IoT Applications

Abstract

The Industrial Internet of Things (IoT) is a platform that supports the deployment of a wide range of smart manufacturing solutions. MEMS sensors are critical components in the infrastructure that forms this Industrial IoT. As this infrastructure proliferates, it will continue to drive demand for increasingly advanced yet cost-effective sensor technologies. To satisfy this demand, the requirement for semiconductor processing equipment that enhances the customers’ fab productivity and capital efficiency is also growing. 

Lam Research has been working to extend our product lifecycle through technology enhancements and productivity upgrades to our deposition, etch, and clean technologies to ensure we meet the needs of the MEMS and sensor manufacturing community. These developments not only focus on our deep silicon etch technology, which is already an established process used in the fabrication of MEMS devices, but also on the processing of new materials that are key to the next generation of MEMS and NEMS. In parallel, through a process of continuing innovation, we are consistently introducing our own suite of smart manufacturing tools that allow these process solutions to be deployed with improved operational efficiency and productivity.

In this presentation, we will review both these technical and productivity solutions and provide examples of how their parallel implementation can provide the most effective platform for the fabrication of advanced MEMS and sensor technologies.
 

Profile

David gained a B.Eng and PhD in Materials Engineering from Swansea University. His PhD thesis was in the field of organic semiconductors for electronic and optoelectronic applications.

In his professional career, David has accrued more than 20 years of experience in the Semiconductor Capital Equipment and research instrumentation sectors with STS, SPTS and Oxford Instruments. Focused on new technology development, he has a strong process background in plasma etch and deposition for optoelectronics, photonics, MEMS, Power and RF Electronics, as well as advanced chip packaging technologies.

Building on this technical knowledge, David has a proven track record in developing strategic business partnerships; specialising in new technology developments and introduction of enabling process capabilities to leading semiconductor fabs worldwide.

David Joined Lam Research in June 2016 as Senior Director of Business Development for IoT Solutions in the MEMS and Advanced Packaging business group.
 


 

Invited Speaker & Panelist

Mr. Sivakumar MOHANDASS

Company

Amkor Technology

Designation

Senior Director, Sales

Title of Presentation

Enabling IoT Era, through Packaging Technology Innovations

Abstract

Evolving Internet of things is a system of systems. The IoT systems can be a very small device such as an audio media player to very sophisticated systems like the ones we find in cars and planes. Electronic packaging technology plays a signification role in accelerating the IoT application. Expectation from various applications like, Domotics, factory automation (some of these systems must be operational for 30 years) handheld, Wearable devices, Medicine Instruments and devices, automotive- fully automated cars, aerospace, telecom, computer peripherals, typically demands different set of packaging and reliability requirements together with hard real‐time, power, and security requirements.  Continuous innovations in advanced packaging technology will continue drive the system level integration and miniaturization, through SiP, new packaging processes and materials. This presentation shall cover the value creation by OSAT in Enabling the IoT era, through advanced packaging technology innovations.
 

Profile

Siva has been the Country Manager and Senior Director for Amkor Technology Singapore, Leading Amkor’s Sales operations in South East Asia, Since 2014. With over 22 years of semiconductor industry experience, he has been involved various R&D, engineering and business leadership positions in Assembly Packaging Technology R&D, Equipment solutions for advanced packaging, and in OSAT’s. Siva holds a Bachelor & Master degree in Engineering and Executive MBA from New York State University. He has published more than 40 technical articles and participated in key technical forms.


 

Panelist

Mr. Ayo KAJOPAIYE

Company

SEMI (Global Headquarters), USA

Designation

Project Coordinator, Collaborative Technology Platforms

Profile

 

Ayo is a Project Coordinator for SEMI and works in the Collaborative Technology Platforms group. His current work focuses on helping connect major players in various industries through SEMI’s Special Interest Groups. These groups help promote progress and address topics that impact the specific industry. He currently serves as the coordinator for the Smart Manufacturing Special Interest Group America’s chapter. Before joining SEMI, Ayo worked as a Project Coordinator at an architect firm in the Bay Area where he helped manage various retail projects for Apple Inc.
 

 

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