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Advanced Packaging Forum

Thank you for your participation at SEMICON Southeast Asia 2016!

We hope the technical and business sessions have benefitted you, the sessions would not be successful without your enthusiasm.

We hope to see you at SEMICON Southeast Asia 2017 at SPICE Arena on 25 - 27 April 2017 again.

PLEASE NOTE:

For downloading of publishable proceedings, a survey email will be sent to you 2 weeks after the show. Upon completion, you will be receiving the instructions for the downloadings.

Thank you for your feedback to help us to improve.

Hope to see you in our next events in Singapore, 2-days technical conference with table-top exhibition and a networking cocktail.

Event Date Venue

Advanced Semiconductor Technology Conference (ASTC)

 October 6-7, 2016    Singapore 

FLEX Southeast Asia

 October 6-7, 2016    Singapore

Please contact Ms Shannen Koh at skoh@semi.org for more details.

Only presentation slides with explicit permission from the speaker are shared below.

Wednesday, 27 April 2016 | 09:30 – 17:00hrs
SPICE Arena (Room 6, Level 2), Penang, Malaysia

Organised by:

Sponsored by: 

 

                        

                                                

 

                                  

                                                                                               

 

Theme:

Advanced Packaging Technologies: Cost-effective Solutions for New and Legacy Applications

 

Abstract: This forum will provide the latest insights, technology trends in packaging for high performance applications, including computing, mobile devices, IoT, wearables, and automotive. Speakers from leading fabless companies, IDMs, foundries, test and packaging houses, and research institutes will explore key packaging challenges, including process integration, reliability, yield, cost, thermal management and supply chain issues, and application of SiP (System-in-Package).
 

Session Chair:

 

 
  Mr. Nelson WONG, VP – Ball Bonder Business Line
 
Kulicke & Soffa (S) Pte. Ltd.

 

 

Session Co-Chair:

 

 

  

 

 Dr. LEE Teck Kheng, Director of Technology Development Centre
 ITE College

 

 

Time

Presentation

 

09:30-09:35

Welcome Remarks by Session Chair

 

09:35-10:05

 

Keynote Address:

Challenges to Move into New Semiconductor Era

Mr. Yohei “Fred” SATO, Director, ATS Marketing Dept. ATSBU, Tokyo Electron Limited

[PRESENTATION] 14.2MB

 

10:05-10:35

 

Electroplating Challenges and Solutions for High Density Fan Out (HDFO) Packaging

Mr. Damo SRINIVAS, MD, Business Development , Lam Research Corporation

 

10:35-10:50

 

Break & Networking Time

10:50-11:20

 

Cost effective System-in-Package Solution

Mr. Aronson Lin, Director, Central Engineering Development & Engineering Integration, ASE Group (ASE Chungli)

 

11:20-11:50

Packaging Security for the IoT Era

Mr. Farhang YAZDANI, President and CEO, BroadPak Corporation

 

11:50-12:20

Deep Si Etching for Advanced Packaging and Various Applications

Mr. Tom NI, Vice President & CTO,  Advanced Micro-Fabrication Equipment Inc

[PRESENTATION] 5.6MB

 

12:20-13:15

 

Conference Lunch

13:15-13:45

High Density Fan-Out (HDFO) Technology – Challenges and Opportunities

Dr. Shan GAO, Principal Member of Technical Staff (PMTS), Packaging Technology & Integration (PTI), GLOBALFOUNDRIES

 

13:45-14:15

Process and Equipment Technology for Advanced Packaging

Dr. Arvind SUNDARRAJAN, Head of Asia Product Development Centre, Applied Materials Inc

 

14:15-14.45

Known Good Package, The New Standard for Mass Reflow S.I.P.

Mr. Alex NIES, Head of Product Management for Advanced Packaging Mass Reflow Business Line, Kulicke & Soffa

[PRESENTATION] 3.1MB

 

14:45-15:15

SiP's Role in the Expansion of IoT

Ms. Jan VARDAMAN, Founder and President, TechSearch International Inc

[PRESENTATION] 5.97MB

 

15:15-15:30

 

Break & Networking Time

15:30-16:00

Application of Terahertz Time-Domain Spectroscopy on Highly Reliable Encapsulation of Semiconductor Devices

Dr. Shang YANG, Senior R&D and Application Engineer, Advantest (Singapore) Pte. Ltd.

[PRESENTATION] 2.9MB

 

16:00-16:30

Ultralow Residue No Clean Material for Advanced Packaging Assembly

Mr. Kenny CHIONG Kung Chuan, Senior Technical Support Engineer, Indium Corporation

[PRESENTATION] 2MB

 

16:30-17:00

SiP (System-in-package) Application in IoT and its Requirements on Manufacturing Equipment

Mr. Nelson FAN, VP of Business Development, ASM Technology Singapore Pte. Ltd.

 

17:00-17:05

Closing Remarks by Session Chair

 

Program subject to change without prior notice.

 

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