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Advanced Packaging Forum 2017

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Wednesday, 26 April 2017 | 10:00 – 17:15hrs
SPICE Arena (Conference Room 7, Level 2), Penang, Malaysia

Organised by:

 

Sponsored by: 

 

                    

             

 

                                                                                                                                           

 

Theme:

 

Cost Effective SiP and WLP Packaging Solutions

 

Abstract:

This forum explores the emerging and latest technology trends and driver and their packaging needs. As more functions packed into a mobile device and the demand for longer battery power, package innovation and solutions are needed to complement the demand for performance. SiP and WIP are leading candidates that meets the needs. However, total packaging cost is critical for mass adoption. Various technology provider, material suppliers and manufacturers are working together to meet the challenges to develop cost effective solutions.

 

 

 

Session Chair:
Mr. Nelson WONG

Vice President, Ball Bonder Business Line, Kulicke & Soffa Pte Ltd, Singapore

 

 

 

Session Co-Chair:
Ms. Lily KHOR

Group Manager, Research & Development, Carsem (M) Sdn Bhd, Malaysia

 

Time

Presentation
 

10:00-10:05

Welcome Remarks by Session Chair
 

10:05-10:30

Keynote Address:
An Overview of High Volume IC Package Manufacturing for High Miniaturization

Mr. Laurent HERARD, Group Vice President, Back End Manufacturing & Technology R&D, STMicroelectronics Pte Ltd, Singapore

 

10:30-10:55

Plasma Dicing: Reducing the Cost of Singulating Thinner, Smaller Die

Mr. Richard BARNETT, Etch Product Manager, SPTS Technologies Ltd, UK
 

10:55-11:20   

Optimisation of Degas, Etch and Ti/Cu Deposition Processes for Wafer and Panel Level Fan Out

Mr. Andreas ERHART, Senior Manager, Product Marketing, Evatec AG, Switzerland

[PRESENTATION] 2.61MB 
 

11:20-11:40  

Break & Networking Time
 

11:40-12:05 

Future Positioning of Advanced Packaging Technology

Dr. Choon LEE, Global Chief Technology Officer, Advanced Packaging, Lam Research Corporation, USA
 

12:05-12:30   

Enabling System Integration Through Advanced Packaging

Mr. Avinash SHANTARAM, Business Development Manager, Applied Materials SEA Pte Ltd, Singapore
 

12:30-13:30

Conference Lunch
 

13:30-13:55

Improving Wafer Dicing Throughput in Advanced MEMS Applications: The Benefits of Applying Deep Reactive Ion Etch vs. Conventional Mechanical Blade or Laser Dicing

Mr. Soon Chiah CHEW, Senior Manager, Business Development (SEA), Advanced Micro-Fabrication Equipment International Pte Ltd, Singapore 
[on behalf for Dr. Songlin XU, Senior Director, Advanced Micro-Fabrication Equipment Inc, Shanghai, China]

[PRESENTATION] 4.06MB 
 

13:55-14:20

Package Solution for Heterogeneous Integration & System-in-Package

Mr. Stanley WU, Technical Manager, ASE Group, Singapore

[PRESENTATION] 5.98MB 
 

14:20-14:45

Recent Trend of Advanced Materials for Semiconductor Devices

Mr. Takenori FUJIWARA, Research Associate, Toray Industries Inc, Japan

[PRESENTATION] 3.22MB 
 

14:45-15:10

A Cost Effective and Flexible Manufacturing Method for Wafer Level Packages with Scalability

Dr. YOON Seung Wook, Director, Advanced Products & Technology Marketing, STATS ChipPAC Pte Ltd, Singapore

[PRESENTATION] 1.96MB 
 

15:10-15:30

Break & Networking Time
 

15:30-15:55

The New Horizon of Electronics: A Change in Mindset to Deliver Cost Effective Packages

Mr. Jason PHUA, Senior Manager, Product Management, AP-Hybrid Business Line, Kulicke & Soffa Pte Ltd, Singapore

[PRESENTATION] 3.13MB 
 

15:55-16:20

FOWLP: A Paradigm Shift in Advanced IC Packaging Technology?

Mr. Santosh KUMAR, Senior Technology & Market Research Analyst, Yole Développement, Korea

[PRESENTATION] 5.12MB 
 

16:20-16:45

Temporary Bonding Technologies for Advanced Fan-Out Wafer Level Packaging Applications

Mr. Ramachandran K. TRICHUR, Director, Business Development, Brewer Science Inc, USA

[PRESENTATION] 12.41MB 

 

16:45-17:10

Future Roadmap for Low Cost Bumping

Mr. Samuel LAU, Director, Customer Development & Engineering, PacTech Asia Sdn Bhd, Malaysia

 

17:10-17:15

Closing Remarks by Session Chair
 

 

 

Program subject to change without prior notice.

 

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