65.6339.6361

Future Electronics Manufacturing Forum 2017

Kindly note only presentation slides with explicit permission from the speaker are shared below to the registered attendees.

Due to confidentiality, some speaker may not be able to share their presentation materials. We seek your kind understanding. 

Some presentation slides may still be pending for speakers' internal approval. Please come back here again by early June to check for further updates.  
 

REGISTER NOW and enjoy Early Bird Rates, valid till 14 April 2017.

  SEMICON SEA 2017 Technical Forums are fully supported (100% claimable)                            
  by Human Resources Development Fund (HRDF) !                                               
  AB c                    
  100% Claimable under the Skim Bantuan Latihan (SBL) for eligible Malaysian companies.    

  Click here to download the portal guide & approval letter for claims!                                           

Tuesday, 25 April 2017 | 11:00 – 17:00hrs
SPICE Arena (Conference Room 6, Level 2), Penang, Malaysia

Organised by:

 

Sponsored by: 

 

 

                      

 

                                                                                                                  

 

Theme:

 

Innovative Disruptions in the Semiconductor Manufacturing Environment

 

Abstract:

Recent advances and low cost technologies for sensing, connecting, and analyzing masses of data has push the boundary of next generation of disruptive improvement in even the highly sophisticated world of semiconductor and electronics systems manufacturing. The revolution of Future Electronics Manufacturing opens new market opportunities for suppliers all along the value chain, and faster delivery of higher quality, more customized products for users at every level, from industrial and computing equipment and data networks to consumer products. However the challenge remains for fabs, OSATS, and even EMS supply chain to better integrate automation and structural data from separate silos to drive actionable and optimized manufacturing efficiencies.
 

In this forum, a panel of speakers will share insights on what is to be expected and opportunities that arise from smart manufacturing for the future.

 

 

Session Chair:
Mr. Ayo KAJOPAIYE
Project Coordinator, Collaborative Technology Platforms, SEMI (HQ), USA

Time

Presentation

11:00 - 11:05 Welcome Remarks by Session Chair

11:05 - 11:30

How AI is Shaping and Changing the Business Landscape of the SEMI and Electronics Supply Chain

Mr. Raman CHITKARA, Global Technology Industry Leader, PricewaterhouseCoopers LLP, USA

[PRESENTATION] 2.31MB 

11:30 - 11:55

Integrating the Electronics Design Chain Across Fabrics and Companies

Mr. Jamie METCALFE, Market Development Manager, Mentor Graphics, USA

[PRESENTATION] 2.48MB 

11:55 - 12:20

Application Towards Future Manufacturing

Mr. CHIANG Gai Kit, Assistant Manager, Product Marketing Management Department, OMRON Asia Pacific Pte Ltd, Singapore

[PRESENTATION] 892KB 

12:20 - 13:20 Conference Lunch

13:20 - 13:45

Emerging Trends in Semiconductor Manufacturing Analytics and Decision Making

Dr. Anantha SETHURAMAN, General Manager, Service Product Development, Applied Materials Inc, USA

13:45 - 14:10

The Role of Smart Equipment in Future Electronics Manufacturing

Dr. Deepak SOOD, Vice President, Global Engineering, Kulicke & Soffa Pte Ltd, Singapore

[PRESENTATION] 1.41MB 

14:10 - 14:35  

The Cornerstone of Smart Manufacturing

Mr. Ranjan CHATTERJEE, Vice President, Emerging Business & Technology Office, Cimetrix, USA

14:35 - 15:00   

The Relevance of IoT and Big Data Analytics In Semiconductor Manufacturing

Mr. Duncan LEE, Manufacturing IT Principal Engineer, Intel Products (M) Sdn Bhd, Malaysia

[PRESENTATION] 1.34MB 

15:00 - 15:15 Break & Networking Time 

15:15 - 15:40   

Real-Time Operational Visibility & Early Warning Detection Delivering on the Promise of Industry 4.0

Mr. Mike ALPERIN, Manufacturing Industry Consultant, Data Science Team, TIBCO Software Inc, USA

15:40 - 16:05

An Adaptive Manufacturing Process with Machine Learning to Improve Productivity and Achieve Product Excellence

Mr. George NG, Head of Advanced Analytics & IoT, SAS, Malaysia

16:05 - 16:30

Innovative Advanced Wafer Level Packaging with Smart Manufacturing Solutions

Dr. YOON Seung Wook, Director, Advanced Products & Technology Marketing, STATS ChipPAC Pte Ltd, Singapore

[PRESENTATION] 1.82MB 

16:30 - 16:55   

Coating-Decoating Technology for Protection of Wafers

Dr. Rama Varma RAJAGOPAL, Principal Synthetic Chemist, 3M Singapore Pte Ltd, Singapore

16:55 - 17:00

Closing Remarks by Session Chair

 

Program subject to change without prior notice.

 

Back to Top

Share page with AddThis