IC Failure Analysis Forum 2017

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Wednesday, 26 April 2017 | 10:00 – 17:30hrs
SPICE Arena (Conference Room 6, Level 2), Penang, Malaysia

Organised by:


Sponsored by:      





Effective Failure Analysis in the Age of Internet-of-Things (IoT)



In today’s age of IoT proliferation, people are more connected than ever in their daily activities by a broad array of systems and sensors found in smartphones, tablets, electric cars, visuals or wearables. By the year 2020, according to various sources, it is estimated that about 50 to 100 billion devices will be electronically connected to the internet. To support this exponential growth, integrated circuits and package modules technologies that are found in such IoT devices is advancing at a pace that is so rapid that it is important for failure analysis approaches to keep up with the changes. It is no longer how well we debug failures but how fast we resolve the issues. Employing the most effective diagnostic methodology and tool is critical to ensure quality and timely failure root cause analysis.

This technical forum offers an opportunity to learn from academics, industrial field experts and leading suppliers, the best practice experiences, innovative solutions and new possibilities to achieve this.


Dr. GOH Szu Huat



Session Chair:
Dr. GOH Szu Huat

Senior Manager, Product Diagnostics Engineering, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore



10:00 - 10:05 Welcome Remarks by Session Chair
   Advanced 2.5/3D IC/Packaging Fault Isolation: 

10:05 - 10:30

Imaging Failures in Sub-Micron Devices and Measuring Stresses in 3D ICs

Prof. Andrew TAY, Senior Research Fellow and Adjunct Professor, Singapore University of Technology and Design (SUTD), Singapore


10:30 - 10:55

Overview of 2.5D Package Failure Analysis

Ms. Bernice ZEE, Member of Technical Staff, Advanced Micro Devices, Singapore


10:55 - 11:20

Advances in 3D Fault Localization Using Lock-in Thermography to Enable Easier and Faster Time to Failure Analysis

Mr. David TIEN, Product Line Director, FEI Company, USA

For presentation slides, please email your request directy to David.Tien@fei.com.

11:20 - 11:35 Break & Networking Time

11:35 - 12:00

Non-Destructive Failure Analysis of Advanced Package

Dr. CHU Chih Hsun, Chief Technical Officer, Materials Analysis Technology Inc, Taiwan


12:00 - 12:25

Non-Destructive 3D X-Ray Imaging: An Increasingly Valuable Fault Visualization Technique for Advanced Packaging Failure Analysis

Mr. Raleigh ESTRADA, Director of Marketing and Applications, Carl Zeiss Microscopy, USA


12:25 - 13:10 Conference Lunch

13:10 - 13:35

High-Density LSI Failure Analysis Technology Using an Ultra-High Resolution TDR System

Dr. SHANG Yang, Senior R&D and Application Engineer, Advantest (Singapore) Pte Ltd, Singapore

13:35 - 14:00

Failure Analysis Challenges in the Growing IoT Connected Automotive Industry

Mr. Em Julius DE LA CRUZ, Product Analysis Lab Manager, ON Semiconductor, Malaysia


   Featured Talks: 

14:00 - 14:25

Meeting Automotive Defect Analysis Requirements with Cell-Aware Diagnosis

Mr. Geir EIDE,  Product Marketing Director,  Mentor Graphics, USA


14:25 - 14:50

Failure Analysis of Touch Panels and Displays

Mr. DAI Yufeng, Failure Analysis Manager, Huawei Technologies Co., Ltd.  – 2012 Labs, China &
Mr. Alan STREET, Failure Analysis Consultant, Huawei Technologies Co., Ltd.  – 2012 Labs, China


14:50 - 15:00 IPFA 2017 Conference
15:00 - 15:10 ISTFA 2017 Conference
15:10 - 15:30 Break & Networking Time
   Advanced Physical Failure Analysis: 

15:30 - 15:55

IoT Devices Bring Sample Preparation by Cleaving into the Spotlight

Ms. Janet TESHIMA, Co-Founder, LatticeGear LLC, USA


15:55 - 16:20

Studies of Fluorine-Induced Corrosion and Defects on Microchip Al Bondpads and Auger Monitoring for Quality Control and Assurance

Dr. HUA Younan, Senior Director, Operation & Technical, WinTech Nano-Technology Services Pte Ltd, Singapore

16:20 - 16:45

Broad Area IC Failure Analysis Through Ion Beam Innovations

Mr. Anthony GITHINJI, CEO and FA Team Leader, 4Wave Inc, USA


16:45 - 17:00 Introduction to EDFAS: Roadmap / Offerings for Global FA communities
   Late Breaking News: 

17:00 - 17:25

New Non-Destructive Package Analysis SOBIRCH

Mr. Kohei KUDO, Senior Sales Engineer, Hamamatsu Photonics K.K., Japan

17:25 - 17:30 Closing Remarks by Session Chair
Program subject to change without prior notice.
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