Product & System Test Forum 2017

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Thursday, 27 April 2017 | 10:00 – 15:15hrs
SPICE Arena (Conference Room 6, Level 2), Penang, Malaysia


Organised by:



Sponsored by:







Extension of Moore's Law



Technology always shrink to cater for faster and better application. However, Moore's law transistor shrinking will eventually hit saturation. Furthermore, processing tool cost is very expensive for advance nodes. Thus, we have to look for alternative in horizontal expansion rather than the vertical xtor shrinking direction. Add on derivative to existing mature Technology nodes becomes the key for this horizontal expansion to better cater for the needs of this ever-changing complex society that requires more function beside speed. These derivative add on includes MEMS, NVM, Flash, High-Power module, RF switch, NFC, SiPh, CIS application and so on. In this Forum, we will focus on these derivative add on and its technical challenges and cost involve in testing them.



Session Chair:
Dr. Jeffrey LAM

Vice President, Product, Test & Failure Analysis (PTF), GLOBALFOUNDRIES Singapore Pte Ltd, Singapore




Session Co-Chair:
Mr. TAN Chun Sheng (CS TAN)

Group Vice-President & General Manager, STMicroelectronics Sdn Bhd, Malaysia

Time Presentation
10:00 - 10:05 Welcome Remarks by Session Chair

10:05 - 10:30

An Introduction and Review of CMOS Image Sensors Testing

Dr. TAN Soon Leng, Product Manager, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore &
Mr. Rick YANG, Process Integration Manager, GalaxyCore Inc, Shanghai, China

10:30 - 10:55

Automation Wafer Level Production Testing in Silicon Photonics from A Foundry

Ms. LIM Yee Hwa, Senior Test Engineer, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore

10:55 - 11:20

Latent Defects Detection

Mr. Angelo CUTULI, Product Engineering Director, STMicroelectronics, Singapore &
Mr. Haiching TAN, Senior Product Engineering Manager, STMicroelectronics, Malaysia


11:20 - 11:35 Break & Networking Time

11:35 - 12:00

Test Strategy Impact on Cost of Test

Mr. NG Aik Moh, Field Product Specialist, Teradyne (Asia) Pte Ltd, Singapore


12:00 - 12:25

IoT-Creating a Cost Effective High MultiSite RF Solution

Mr. Tuttipattu Ramaswamy SUJANANDAN, Staff Application Engineer, Advantest (Singapore) Pte Ltd, Singapore

12:25 - 12:50

WLCSP Test Strategy

Mr. Michael FRAZIER, Senior Director, Business Development, Xcerra Corporation, USA


12:50 - 13:50 Conference Lunch

13:50 - 14:15

Boundary Scan and Additional DFT Structures in Enhancing Testability to System

Mr. Sivakumar VIJAYAKUMAR, Technical Marketing Engineer, Keysight Technologies, Singapore

14:15 - 14:40

Effective Plug-And-Play Strategies for 3D-IC Testing

Mr. TAY Chee-Chun, Application Engineer Consultant, Mentor Graphics, Singapore

14:40 - 15:05

WLCSP Challenges for Singulated Probe Methodology

Mr. Raul Arriola NAVARRO, HoD of Technical Product Managers, COHU, Malaysia

15:05 - 15:10 Closing Remarks by Session Chair


Program subject to change without prior notice.


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