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Product & System Testing Forum

Thank you for your participation at SEMICON Southeast Asia 2016!

We hope the technical and business sessions have benefitted you, the sessions would not be successful without your enthusiasm.

We hope to see you at SEMICON Southeast Asia 2017 at SPICE Arena on 25 - 27 April 2017 again.

PLEASE NOTE:

For downloading of publishable proceedings, a survey email will be sent to you 2 weeks after the show. Upon completion, you will be receiving the instructions for the downloadings.

Thank you for your feedback to help us to improve.

Hope to see you in our next events in Singapore, 2-days technical conference with table-top exhibition and a networking cocktail.

Event Date Venue

Advanced Semiconductor Technology Conference (ASTC)

 October 6-7, 2016    Singapore 

FLEX Southeast Asia

 October 6-7, 2016    Singapore

Please contact Ms Shannen Koh at skoh@semi.org for more details.

 

Only presentation slides with explicit permission from the speaker are shared below.

Wednesday, 27 April 2016 | 09:30 – 17:15hrs
SPICE Arena (Room 4 & 5, Level 2), Penang, Malaysia

Organised by:

Sponsored by: 

          

                   

 

Theme:

Advanced Testing Strategy/Methodology for 2.5D and 3D IC Challenges in the Era of IoT

Abstract:

The evolving consumer demands and increasing technology complexity of electronic products are rapidly fueling the need for multi-functional embedded systems. New semiconductor designs and architectures are expanding the market and climbing production volume for 2.5D and 3D IC structured devices. End market applications, including smart devices with wired and wireless infrastructure, automotive, MEMS and sensors, NVM (flash), IoT, wearables, gaming, silicon photonics, and NFC, are growing, and More than Moore device complexity is expected to continue to rise. These new applications and designs in turn are creating challenges for test and high volume manufacturing, requiring innovation in test methodologies and with cost effective solutions.

The Product and System Test Forum will explore the technology trends driving innovation in test and the challenges and solutions coming to market.

Session Chair:

 

 

  Dr. Jeffrey LAM, Vice President
  GLOBALFOUNDRIES Singapore Pte. Ltd.

Session Co- Chair:

  

 

  Mr. TAN Chun Sheng (CS TAN), Group Vice-President/General Manager
  STMicroelectronics Sdn Bhd

Time

Presentation

09:30-09:35

Welcome Remarks by Session Chair

09:35-10:05

Be ready for what’s coming next – Enabling IoT and wearable devices manufacturing system test optimization strategies

Mr. PANG Teik Woei, Application Engineer, Keysight Technologies Sales (Malaysia) Sdn. Bhd.

[PRESENTATION] 3.4MB

10:05-10:35

How Internet of Things will change back end processing

Mr.  Michael FRAZIER , Sr. Director – Business Development ,  Xcerra Corporation

[PRESENTATION] 4MB

10:35-10:50

Break & Networking Time

10:50-11:20

Challenges of Silicon Photonics Testing from A Foundry’s Perspective

Dr. YAP Tiong Leh Johnny, Senior Engineer, GLOBALFOUNDRIES Singapore Pte. Ltd.

[PRESENTATION] 1.9MB

11:20-11:50

MEMS Motion Sensor Testing for Failure Analysis Debug

Mr. Robin CHAO (Chung-Ping, CHAO), Senior Member of Technical Staff, GLOBALFOUNDRIES Singapore Pte. Ltd.

[PRESENTATION] 2.67MB

11:50-12:20

Functional Testing of Multivendor Chips in Modules

Mr. Raja MANICKAM, Founder CEO, Tessolve Semiconductor

[PRESENTATION] 1.8MB

12:20-13:15

Conference Lunch

13:15-13:45

Rolling Up Solutions of Wafer Probing Technologies​

Mr. Joey WU,  Manager, Global Marketing,  MPI Corporation

[PRESENTATION] 3.87MB

13:45-14:25

 

Challenges of High Current Testing in Automotive

Mr.KJ HAN, Test Engineering Senior Manager &

Mr. YEO Chiau Woon, Application Engineer , STMicroelectronics Sdn Bhd

[PRESENTATION] 4MB

14:25-14.55

Improving Effectiveness in Testing Integrated Automotive Device

Mr. Wilmer ILMEDO, Field Product Consultant, Advantest (Singapore) Pte. Ltd.

[PRESENTATION] 3.2MB

14:55-15:25

Implications of Emerging Technologies on Power Amplifier Manufacturing Test

Mr. S’NG Chee Wai (Anthony), Application Engineer, Keysight Technologies

[PRESENTATION] 4MB

15:25-15:40

Break & Networking Time

15:40-16:10

Secure customer application firmware during device level in high volume manufacturing

Mr. Sivarama RAJAH, Senior Manager (Asia Test Engineering), Atmel Malaysia

[PRESENTATION] 0.4MB

16:10-16:40

RFIC Testing from R&D to Production: Choosing a Test Approach to Reduce the Cost of Test

Mr. Gobinath Tamil VANAN, Automated Test Specialist, National Instruments

[PRESENTATION] 2MB

16:40-17:10

High Speed Device with Low Cost Test

Mr. Kingsly CHRISTOPHER,  Director of Engineering,  Lynxemi Pte. Ltd

[PRESENTATION] 1.1MB.

17:10-17:15

Closing Remarks by Session Chair

 

Program subject to change without prior notice.

 

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