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My9-10 (North Wing), Level 1A, MITEC | Wednesday, May 23 | 9:30am to 4:30pm | Paid
Advanced Packaging Forum
Theme: Advanced Packaging Solution for Heterogeneous Integration
Synopsis: In an era where SMART is the buzz word, smart communication, smart connectivity, smart factory, smart transportation, smart living, smart nations and more, the ability to sense, connect and share data at any time, and any place have been the pre-requisites.
There is a tremendous push in the semiconductor packaging towards heterogeneous integration through the use of advanced packaging technologies to integrate multiple functionalities like MEMs, sensors, RF, memory, ASIC etc. Some of the advanced packaging technologies are 2.5/3D, FO-WLP, SIPs (embedded substrate), TSV etc. This forum will take a holistic look of the various advanced packaging technology innovation that has been used or can be used to enable heterogeneous integration.
* Program below subject to change without prior notice.