Advanced Packaging Forum (3)

MY 9-10 | Level 1A | MITEC Wednesday, May 08
9:30am to 5:00pm
Registration Fee Applicable

*Programs and Topics are subject to change without prior notice
** Malaysia Companies HRDF Claim (Subject to T&C and please contact HRDF for more information)

Track Theme:  The Driving Trend in Advanced Packaging -- Smart Manufacturing & Connectivity

Synopsis: In continuation of last year theme in Advanced Packaging forum on Advanced Packaging Solution for Heterogeneous Integration, this year forum elevates technology sharing into the next level of advancement – on Smart Manufacturing and Connectivity.

High-tech manufacturing in the recent years evolve heavily on smart connectivity within production floor and the ability to sense and connect data instantaneously.


Beside investing in packaging techniques advancement for integrated applications, the driving trend is to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.


The topics will delve into the learning of technique advancement for driving applications in Asia and the sharing on smart connectivity in machine learning. An interactive panel discussion will have an exchange of insights by the industry leaders.



Sponsored By:



Do you want to attend this session? Register for SEMICON SEA

Mr. LEE Chee Ping
Senior Manager, Technologist & Technical Marketing
Lam Research Corporation, Singapore
Mr. CHONG Chan Pin
Senior Vice President, EA/APMR and Wedge Bonders Business Units
Kulicke & Soffa Pte Ltd, Singapore
Mr. Favier SHOO
Yole Développement, Singapore
Mr. Nelson FAN
Vice President of Business Development
ASM Pacific Technology
Mr. Chris JONES
Director – PVD Product Management
SPTS Technologies, United Kingdom
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