Advanced Packaging Forum [4]

MY 11 | Level 1A | MITEC Wednesday, August 12
9:30am to 5:00pm
Registration Fee Applicable

*Programs and Topics are subject to change without prior notice

REGISTRATION FEE (Early Bird Rate - till 11 July 2020) - Save up to 15% savings!

 SEMI Member USD 130 SGD 180
 Non-Member USD 170 SGD 230
 Student (with valid student pass) USD 50 SGD 65
 Group Discount (3 pax & above) Enjoy additional 15% off early bird rate!

Keen to attend? Register Here

This forum is supported by HRDF. [Applicable only for Malaysia Companies]
For Malaysia Companies HRDF Claim: Please download the Letter of Endorsement from HRDF.
The approval of the training grant is subject to the terms and conditions set by PSMB. Please contact HRDF for more information.
Download Letter of Endorsement.

Track Theme: Heterogeneous Integration & Challenges in System Scaling and Performance in the 5G Era

As we are entering into an exciting era of digital transformation, to a world of new experience, we will witness the promise of 5G with seamless data transfer. It will couple with innovation of smart devices, accelerating the growth in connectivity, smart data analytics and artificial intelligence. With 5G technology in the works, demand for seamless data transfer and processing will only accelerate the growth. Having a super-powered device with multi-functions is an essential in this age. Device manufacturability with high level of integration will demand new requirements moving forward. In this need for integration, semiconductor packaging in being pushed to the fore front as a solution for performance, flexibility and cost. Heterogeneous Integration in SiP or modules is one of the most discussed solution given the multiple challenges. At this forum, we provide a platform for key opinion leaders from the industry to share the best practices and their innovative solutions to overcome these challenges. Learn the various packaging and assembly techniques that will guide you to resolve your technical challenges and exchange your perspectives at this interactive platform.





Distinguished Speakers (Inviting):
AmkorASEASMBesiDowEvatecJabilKulicke & SoffaLam ResearchMediaTekMicronSPTSTELUniversal InstrumentsUTAC



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