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Track Theme: Heterogeneous Integration & Challenges in System Scaling and Performance in the 5G Era
As we are entering into an exciting era of digital transformation, to a world of new experience, we will witness the promise of 5G with seamless data transfer. It will couple with innovation of smart devices, accelerating the growth in connectivity, smart data analytics and artificial intelligence. With 5G technology in the works, demand for seamless data transfer and processing will only accelerate the growth. Having a super-powered device with multi-functions is an essential in this age. Device manufacturability with high level of integration will demand new requirements moving forward. In this need for integration, semiconductor packaging in being pushed to the fore front as a solution for performance, flexibility and cost. Heterogeneous Integration in SiP or modules is one of the most discussed solution given the multiple challenges. At this forum, we provide a platform for key opinion leaders from the industry to share the best practices and their innovative solutions to overcome these challenges. Learn the various packaging and assembly techniques that will guide you to resolve your technical challenges and exchange your perspectives at this interactive platform.
Distinguished Speakers (Inviting):
Amkor, ASE, ASM, Besi, Dow, Evatec, Jabil, Kulicke & Soffa, Lam Research, MediaTek, Micron, SPTS, TEL, Universal Instrument, UTAC