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Studies of Advanced Failure Analysis Techniques and Applications in Advanced Packaging Devices and Product & System Level Test Processing

Thursday, May 09
2:00pm to 2:25pm

In this paper/presentation, we will study FA methodologies involved when the package is detected with failed functionality at Product Level Test, and we will show some case-study of root cause identification using 3D X-ray, CSAM, Thermal Analysis, Cross-section/ SEM analysis (by using different sample preparation methods such as mechanical polishing, FIB and ion milling etc.). 

In this paper/presentation, we will also introduce our latest developed FA techniques for packaging level moisture invasion identification methods by using Heavy Water/SIMS and Nano FluoroProbeTM  approaches.

 
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