WLCSP Advanced Inspection Challenges and Solutions

Thursday, May 09
11:10am to 11:35am

The continuous growth of product quality requiremnts in IoT, mobility and automotive markets, is driving the need for upstream detection of micro-crack defects on integrated circuits, not otherwise identifiable via electrical test.

This is a growing segment in the semiconductor inspection as WLCSP content increases within advanced packaging.

Infra-Reed (IR) imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional inspection systems.

In this seminar, Cohu will describe its breakthrough solution by integratin IR imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection.



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