SEMICON SEA 2018 Program

SEMICON SEA 2018 Program



Thank you for your participation at SEMICON Southeast Asia 2018!

Hope the event was fruitful for your business matching, technical learning and networking!

We will see you next year 7-9 May 2019 in Kuala Lumpur again.

Proceedings (with explicit permission) will be shared by mid of June.

Post Show Report will be ready by end of June.

For inquiry, please contact Ms. Candice Lim at clim@semi.org or +65 6391 9518.


SEMICON SEA 2018 Technical Forums are fully claimable by Human Resources Development Fund (HRDF) !
100% Claimable under the Skim Bantuan Latihan (SBL) for eligible Malaysian companies.

Click here to download the portal guide & approval letter for claims!

Download the approval letter from HRDF here


Technical Forums at SEMICON Southeast Asia 2018Stage Image

SEMICON Southeast Asia is the ideal place to discover the technologies and trends that are driving advances in microelectronics to electronics manufacturing. From our series of technology and business forums, to conversations with our exhibiting companies, you will find ideas and solutions to your challenges, meet the people you need to know, and take away the information you need to advance your projects, innovations, and companies into the future.

The SEMI Southeast Asia Team works closely with their supporting committees and the manufacturing and R&D organizations to develop programs to match the specific needs of Southeast Asia's microelectronics and electronics ecosystem.

  1. Technology Innovation Forum
    Theme: Smart Manufacturing Keynote Speech

    Synopsis: What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain?  The electronics manufacturing supply chain holds many different perspectives, but one thing is clear - the impact of Smart Manufacturing will be huge.

    Recent advances and low-cost technologies for sensing, connecting, and analyzing masses of data has push the boundary of next generation of disruptive improvement in even the highly sophisticated world of semiconductor and electronics systems manufacturing. Advanced automation and sensing technology coupled with highly sophisticated advanced data analytics now offer the semiconductor manufacturing sector an opportunity to better integrate automation and structural data from separate silos to drive actionable and optimized manufacturing efficiencies.

    The Technology Innovation forum on Smart Manufacturing Keynote Speech from presenters across the electronics manufacturing supply chain offers relevant and thoughtful insights of how Smart Manufacturing is revolutionizing the semiconductor manufacturing industry.

  2. Market Trends Briefing

    Synopsis: Semiconductor industry leapfrogged beyond expectation and set a new milestone in of semiconductor revenue of more than USD400 billion in 2017.  Indeed 2017 was a record-setting year for the entire semiconductor supply chain industry with growth expected to continue into this year as new semiconductor applications for the industrial, automotive, artificial intelligence, and consumer markets proliferate at an ever-increasing rate.

    In this half a day Market Trend forum,  subject matter experts from the chip makers, market research analysts covering equipment and materials, applications domain and advanced packaging space as well as financial analyst will share with you the latest current industry trends and drivers for 2018 and beyond. 

  3. Advanced Packaging Forum

    Theme: Advanced Packaging Solution for Heterogeneous Integration

    Synopsis: In an era where SMART is the buzz word, smart communication, smart connectivity, smart factory, smart transportation, smart living, smart nations and more, the ability to sense, connect and share data at any time, and any place have been the pre-requisites.

    There is a tremendous push in the semiconductor packaging towards heterogeneous integration through the use of advanced packaging technologies to integrate multiple functionalities like MEMs, sensors, RF, memory, ASIC etc. Some of the advanced packaging technologies are 2.5/3D, FO-WLP, SIPs (embedded substrate), TSV etc. This forum will take a holistic look of the various advanced packaging technology innovation that has been used or can be used to enable heterogeneous integration.

  4. IC Failure Analysis and Defects Characterisation Forum

    Theme: Transformation of Defect Root Causation in the age of IoT

    Synopsis: There are four main driving forces for the semiconductor industry. 1) The race to produce faster and smaller front-end devices; 2) Challenges and innovations in new packaging technology in light of product and system miniaturization, 3) proliferation in the diverse applications relating to IoT devices and their rapid paced evolution 4) increasing complexity of our systems and technologies in a competitive environment. Last year's edition of the forum, we addressed extensively about failure diagnostic on advanced packaging device challenges; this year we intend to focus on IoT. 

    By nature of IoT, the value of the chips are not measured just by its performance. The chips are being put to a multitude of targeted industries which include mobile, displays, automobiles, manufacturing, utilities, and others. Therefore, the other requirements of an IoT chip such as power consumption, durability, cost-effectiveness and turnaround time-to-production are integral components of the entire value chain. Failure analysis and defect characterization can play an important role to ensure the quality of a chip. Flaws as a result of either process or design constraints, or both, are inevitable in the early stages of a tapeout. Particularly, on the point of effective and efficient defect root causation, this forum seeks to broaden defect diagnostics perspectives and shares insights into the symbiotic relation between inline defect characterization and failure analysis in faster and more effective fault isolation in the semiconductor devices.

  5. Product & System Level Testing Forum

    Theme: Smart and Robust Testing in Big Data Analytics Solutions

    Synopsis: Fundamentally Product and System testing is a process of decision making based on data. Complex and huge amounts of data are analysed and decisions made as to whether the product or system being tested meets requirements. Such sophisticated decision making systems require the ability to use data in a smart way. This brings distinct competitive advantages to companies that know how to use and analyse the large pool of data to make intelligent decisions. Testing is gradually moving from a reactive engineering mode to a predictive mode. Robustness is another key element. Especially now with mission critical product and system applications, test and product engineers want test methods that are robust and will be able to withstand high current, high voltage, and high usage as well. Companies that can master Smart Data and Robust test systems will have a strong competitive advantage in the new breed of semiconductor product/system testing.


  6. MEMs & Sensors Forum

    Theme: Sensing for the future

    Synopsis: Sensing technologies in high-tech manufacturing environment have been advancing rapidly over the last decades, with the buzz of smart manufacturing, Industrial 4.0. Progressing and innovating are critical to keep up with the pressure from semiconductor market. In this forum, learn the various approach that smart factories have been adopting and the new developments that are available

Share page with AddThis