SEMICON SEA 2019 Programs Catalog
SEMICON SEA 2019 Programs Catalog
Dr LEE Wah Pheng
Associate Professor and the Head of Centre for Postgraduate Studies and Research
Tunku Abdul Rahman University College
Synopsis
Semiconductor processing technologies have advanced rapidly over the last decade, and such is not possible without the continuous improvement in the production tool, and cleanroom control. To attain ULSI and integrated circuits (ICs) with varied functionalities, performances and reliabilities; complex process know-how, advanced fabrication techniques, start-of-the-art technologies, devising of novel devices, and the continuous search for new materials are all inevitable. An in-depth understanding of these deep-submicron process technologies and ULSI devices are definitely crucial, not only for better understanding but also to serve as the essential background for the ever important technology invention and further development in the areas.
What You Will Learn
- Essential substrate and device electrical properties for continuous engineering improvement
- Current and future scaling technology challenges in device size, power usage and pricing
- Substrate preparation technology, layout design processes and cleanroom requirements
- Advance planar and 3D IC device fabrication technology below 22nm technology node
- Trends of die packaging and testing include SoC, SiP and 3D integration technology
Course Content For Day 1
Substrate and Device Electrical Properties
- Important concept of silicon as substrate material
- Essential diode, BJT and MOS electrical properties
Current and Future Semiconductor Scaling Technology Challenges
- Evolution of silicon based device integration technology
- Strained silicon and SOI technologies for speed improvement
- Scaling technology challenges in power and MOS structure
- 3D transistor of FinFET for beyond 22nm technology node
- Fabrication technologies and current offered foundry services
Substrate Preparation Technology
- Important of substrate sizes and die costing
- Silicon substrate preparation processes
- Polished silicon substrate surface inspection method
Integrated circuit Layout Design Processes
- Basic design steps of integrated circuit
- Design rules, active and passive device layout design
Dr LEE Wah Pheng
Associate Professor and the Head of Centre for Postgraduate Studies and Research
Tunku Abdul Rahman University College
Synopsis
Semiconductor processing technologies have advanced rapidly over the last decade, and such is not possible without the continuous improvement in the production tool, and cleanroom control. To attain ULSI and integrated circuits (ICs) with varied functionalities, performances and reliabilities; complex process know-how, advanced fabrication techniques, start-of-the-art technologies, devising of novel devices, and the continuous search for new materials are all inevitable. An in-depth understanding of these deep-submicron process technologies and ULSI devices are definitely crucial, not only for better understanding but also to serve as the essential background for the ever important technology invention and further development in the areas.
What You Will Learn
- Essential substrate and device electrical properties for continuous engineering improvement
- Current and future scaling technology challenges in device size, power usage and pricing
- Substrate preparation technology, layout design processes and cleanroom requirements
- Advance planar and 3D IC device fabrication technology below 22nm technology node
- Trends of die packaging and testing include SoC, SiP and 3D integration technology
Course Content For Day 2
Semiconductor Cleanroom Requirements
- Semiconductor industry cleanroom standards
- Cleanroom types and selection of cleanroom filter
Advance Device Fabrication Technologies
- Lithography technology and advance lithography platform
- Ion implantation technology and advance ion implanter design
- Etching technology and advance etching platform for 3D etching
- Deposition methods include physical, chemical, ALD and thermal oxidation
- Device fabrication flow using CMOS process as an example
Die Packaging and Testing
- Flow of die packaging assembly technology
- Wafer mounting, dicing, attach and wire bonding technology
- Evolution of encapsulation, include SoC and SiP package styles for integrated circuit
- Integrated circuit inspection, die cost and yield
3D Integration Technology
- Evolution of 3D integration technology
- Application and types of silicon interposer and through silicon via technology
- Introduction of Hybrid Memory Cube (HMC) 3D IC memory chip
Enabling a Conducive E&E Ecosystem in Malaysia - Roles of Policies and Infrastructure
More details will be furnished at later date.
For any inquiries, please contact Linda Tan : ltan@semi.org or +65.6339.6361
SEMI Southeast Asia is pleased to announce our collaboration with MATRADE on the International Sourcing Program (INSP) which is a One-on-One Business Meeting scheduled to be held on 8 May 2019 at MITEC, Kuala Lumpur.
Foreign buyers who are selected to attend this programme are entitled for complimentary accommodation (up to 3 days 2 nights stay from 7-9 May 2019) including airport and hotel transfers. This privilege is based on first-come-first-serve basis.
- Hosted Buyers are advised to arrive in Kuala Lumpur International Airport (KLIA) by 6 May 2019
- Hosted Buyers who intend to stay longer (after 9 May 2019) for follow up meetings, will have to bear their own expenses for the additional night's stay as well as own ground transportation and transfers
- Application to participate in this programme is subject to approval by MATRADE and successful participants will be notified officially by MATRADE
To register your interest, please contact Ms Linda Tan at ltan@semi.org or +65.6339.6361
Proudly brought to you by :-
Mr. Geoffrey TAN
Director
Self Start-Up Company
Synopsis
The course introduces SMT process and back-end assembly with understanding of the terminologies in SMT with acquisition of SMT materials and equipment. Introduction to the industry standard used which is IPC, JDEC and MSL and SMT defect process trouble-shooting guides would be taught in the class well.
What You Will Learn
- SMT process flow
- Stencil design
- Solder paste printing
- Pick and place
- Reflow soldering
- Printed circuit board manufacturing
- SMT process defects and remedies
Course Content For Day 1
1. Basic SMT Process Flow
Direct and indirect materials used in SMT
- Solder paste, epoxy, fluxes, cleaning chemicals, under fills, ACP, active and passive devices
- Chemical, mechanical and physical properties
- Bill of material, technical data sheet, and material safety data sheet
Process Flow of SMT Hybrid
- Single sided, double sided, high mix hybrid assemblies and the FA tree analysis charts
Component identification and size
- Imperial and metric systems on chips as well as IC packages terminology and nomenclature
Solder paste type and particle size
- SAC305,405 and low temperature paste as well as type 1-6 particle and fluxes type (RA,RMA,WS)
- Latest technology on solder paste Game- Changer manufactured by Henkel
2. Stencil Design
Stencil selection, types like laser cut, E-form, etc., fabrication methodology, design aspects and area ratios and 3D stencil for solder paste and glue
Group Work: Cold Sweat United Airlines - Taguchi Fishbone Diagram
3. Solder Paste printing
Machine overview
- Types of printer air bag and open type printers, solder paste jetting, and dispensing
Squeegee materials and selection
- Metal vs rubber squeegee, Rheometric pump squeegee
Solder paste printing
- Stencil vs solder paste printing design guidelines
Setup and operation
- Printer parameter settings and overview on Taguchi fishbone diagram on printing setup
4. Pick and Place Process
Types of mounters
- Modular, rotary turret, and single axis mounters
Selection criteria in selection of a mounter
- UPH, maintenance easibility, spare parts, ROI and interchangeability features of a mounter
Key criteria for a good mount
- IPC 610A Std and JDEC
Mr. Geoffrey TAN
Director
Self Start-Up Company
Synopsis
The course introduces SMT process and back-end assembly with understanding of the terminologies in SMT with acquisition of SMT materials and equipment. Introduction to the industry standard used which is IPC, JDEC and MSL and SMT defect process trouble-shooting guides would be taught in the class well.
What You Will Learn
- SMT process flow
- Stencil design
- Solder paste printing
- Pick and place
- Reflow soldering
- Printed circuit board manufacturing
- SMT process defects and remedies
Course Content For Day 2
5. Reflow Soldering
Types of reflow soldering ovens
- Forced convection, IR and vapor phase reflow ovens, 5-12 zones ovens pros and cons
The 4 components of the reflow profile
- Preheat, soak, reflow, cool process, specs and solder joint defects related to profile (pop-corn, grainy joint, cold solder)
Profiling methd the key consideration
- Types of reflow profile, i.e. linear, flat top or conventional ramp, soak, spike.
6. Printed Circuit Board Process Manufacturing
Types of PCB
- CEM1, CEM2, FR4, BT substrate
Types of PCB plating
- ENIG, electroplating, copper plating, HASL, ENTEC
Plating thickness measurement
- XRF principles and measurement of plating thickness
7. PCBA Rework Methodology
- Type of BGA, IC Rework machine and nozzles
- Methodology of BGA Rework
- Profile for rework
8. PCBA Cleaning
- Types of chemicals used in cleaning PCBA (solvent, aqueous and DI Water)
- Types of cleaning machine(ultrasonic, centrifuge, spray jet etc.)
- Cleanliness check using contact angle, bond pull, high mag, etc.
9. SMT Process Defects and Remedies
- Identifying the typical SMT defects related to the 6M i.e. Man, Machine, Methods, Materials, Mother nature (environment) and measurement.
- Remedial and correction of the above defects together with process optimization.
SEMI is a not-for-profit global trade association. The primary mission of SEMI is about developing thought leadership and fostering talent development with the utopian vision of facilitating the development of the electronics and semiconductor industry. SEMI Southeast Asia brings that advocacy initiatives in focus for the Southeast Asia regions and endeavours to enable a growing, technologically adept and resilient engineering communities in the region. Talent shapes the E&E industry. Innovations in any industry is dependent on human ingenuity and more so, the sustenance of the industry hinges on influx of new graduating talents.
However, in today context, STEM interest and engineering enrolment is in sharp decline. One of the major advocacy initiatives that SEMICON Southeast Asia organises is the Workforce and Talent Development Pavilion. In answering the call for action on promoting STEM in our young, SEMI will be conducting the award-winning SEMI High Tech U program for secondary school children. Participant to the program will be exposed to the world of science and maths that define the high technology semiconductor electronics to spark STEM interest in our young. In addition, we will also be hosting a “Woman in Engineering Panel” to encourage diversity in engineering enrolment and career choice. To top that of, the pavilion will also showcase an engineering career fair. The target is to host at least 20 semiconductor hiring companies for graduating students from universities and polytechnics.
For more details, please contact Linda Tan @ ltan@semi.org or +65.6339.6361.
