SEMICON SEA 2019 Programs Catalog
SEMICON SEA 2019 Programs Catalog
*Programs and Topics are subject to change without prior notice
*Malaysia companies are entitled to HRDF 100% claimable
Track Theme: The Driving Trend in Advanced Packaging -- Smart Manufacturing & Connectivity
Synopsis: In continuation of last year theme in Advanced Packaging forum on Advanced Packaging Solution for Heterogeneous Integration, this year forum elevates technology sharing into the next level of advancement – on Smart Manufacturing and Connectivity.
High-tech manufacturing in the recent years evolve heavily on smart connectivity within production floor and the ability to sense and connect data instantaneously.
Beside investing in packaging techniques advancement for integrated applications, the driving trend is to integrate into a full system of high performance and functionality devices with smart manufacturing. The connected system in packaging world shall drive for yield performance excellence in high-tech manufacturing.
The topics will delve into the learning of technique advancement for driving applications in Asia and the sharing on smart connectivity in machine learning. An interactive panel discussion will have an exchange of insights by the industry leaders.
Dr LEE Wah Pheng
Associate Professor and the Head of Centre for Postgraduate Studies and Research
Tunku Abdul Rahman University College
Synopsis
Semiconductor processing technologies have advanced rapidly over the last decade, and such is not possible without the continuous improvement in the production tool, and cleanroom control. To attain ULSI and integrated circuits (ICs) with varied functionalities, performances and reliabilities; complex process know-how, advanced fabrication techniques, start-of-the-art technologies, devising of novel devices, and the continuous search for new materials are all inevitable. An in-depth understanding of these deep-submicron process technologies and ULSI devices are definitely crucial, not only for better understanding but also to serve as the essential background for the ever important technology invention and further development in the areas.
What You Will Learn
- Essential substrate and device electrical properties for continuous engineering improvement
- Current and future scaling technology challenges in device size, power usage and pricing
- Substrate preparation technology, layout design processes and cleanroom requirements
- Advance planar and 3D IC device fabrication technology below 22nm technology node
- Trends of die packaging and testing include SoC, SiP and 3D integration technology
Course Content For Day 1
Substrate and Device Electrical Properties
- Important concept of silicon as substrate material
- Essential diode, BJT and MOS electrical properties
Current and Future Semiconductor Scaling Technology Challenges
- Evolution of silicon based device integration technology
- Strained silicon and SOI technologies for speed improvement
- Scaling technology challenges in power and MOS structure
- 3D transistor of FinFET for beyond 22nm technology node
- Fabrication technologies and current offered foundry services
Substrate Preparation Technology
- Important of substrate sizes and die costing
- Silicon substrate preparation processes
- Polished silicon substrate surface inspection method
Integrated circuit Layout Design Processes
- Basic design steps of integrated circuit
- Design rules, active and passive device layout design
Dr LEE Wah Pheng
Associate Professor and the Head of Centre for Postgraduate Studies and Research
Tunku Abdul Rahman University College
Synopsis
Semiconductor processing technologies have advanced rapidly over the last decade, and such is not possible without the continuous improvement in the production tool, and cleanroom control. To attain ULSI and integrated circuits (ICs) with varied functionalities, performances and reliabilities; complex process know-how, advanced fabrication techniques, start-of-the-art technologies, devising of novel devices, and the continuous search for new materials are all inevitable. An in-depth understanding of these deep-submicron process technologies and ULSI devices are definitely crucial, not only for better understanding but also to serve as the essential background for the ever important technology invention and further development in the areas.
What You Will Learn
- Essential substrate and device electrical properties for continuous engineering improvement
- Current and future scaling technology challenges in device size, power usage and pricing
- Substrate preparation technology, layout design processes and cleanroom requirements
- Advance planar and 3D IC device fabrication technology below 22nm technology node
- Trends of die packaging and testing include SoC, SiP and 3D integration technology
Course Content For Day 2
Semiconductor Cleanroom Requirements
- Semiconductor industry cleanroom standards
- Cleanroom types and selection of cleanroom filter
Advance Device Fabrication Technologies
- Lithography technology and advance lithography platform
- Ion implantation technology and advance ion implanter design
- Etching technology and advance etching platform for 3D etching
- Deposition methods include physical, chemical, ALD and thermal oxidation
- Device fabrication flow using CMOS process as an example
Die Packaging and Testing
- Flow of die packaging assembly technology
- Wafer mounting, dicing, attach and wire bonding technology
- Evolution of encapsulation, include SoC and SiP package styles for integrated circuit
- Integrated circuit inspection, die cost and yield
3D Integration Technology
- Evolution of 3D integration technology
- Application and types of silicon interposer and through silicon via technology
- Introduction of Hybrid Memory Cube (HMC) 3D IC memory chip
Enabling a Conducive E&E Ecosystem in Malaysia - Roles of Policies and Infrastructure
More details will be furnished at later date.
For any inquiries, please contact Linda Tan : ltan@semi.org or +65.6339.6361
* Programs and Topics are subject to change without prior notice
* Malaysia companies are entitled to HRDF 100% claimable
Theme: Sustainability Manufacturing for Higher Productivity and Lower Cost of Ownership in Semiconductor Production
Synopsis: Manufacturing in high technology industry inadvertently is heading for a revolutionary transformation with major advances in enabling innovations addressing energy efficiencies and clean emissions in electronics manufacturing.
Sustainability has for past being view as a secondary concern is not receiving much needed attention as semiconductor companies advanced in their corporate social responsibility towards environment protection. In so called ‘green’ manufacturing of reducing pollution, recycling and reusing of what is considered waste and reducing energy consumption is starting to gain momentum in the Southeast manufacturing regions. New ways of thinking of green semiconductor manufacturing is offering, apart from a sustainable environment, also a considerable competitive advantage to semiconductor companies through cost savings.
Both sustainability and energy efficient manufacturing yields benefits not only in terms of an improved bottom line, but in terms of employee motivation, morale, and public relations. This forum offers a unique view points of the opportunities available in tackling both of these important elements in high technology semiconductor manufacturing of today.
Dr. LEE Teck Kheng
Director of Technology Development Centre
ITE College Central
Principles in Advanced Packaging
Learn everything on IC Packaging from packaging trends, design and processes to new development in IC packaging. The course aims to enhance your professional knowledge and enhance your return to your organization. You don’t KNOW what you don’t KNOW in IC packaging.
Course Objectives
The principles of Microelectronics packaging range from Electronics, Mechanical, Materials to Chemical Engineering. Due to this multi-discipline nature, many industry professionals don’t know what they don’t know as they do not undergo multi-discipline training to understand these principles. The objectives of this course are to strengthen the know-how of professionals in IC packaging so that they can enhance their career opportunities in Semiconductor industry. With these principles, you can better appreciate the new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc. In addition, you will be able to re-apply these principles to increase your technical contributions and assist your organization to stay ahead of the competition through innovation. The learning will be reinforced through problem base solving through actual industry situations.
This 1 day course will provide the necessary technical knowledge for industry professionals. The course covers both the manufacturing and R&D know-how in IC packaging. This course is a must for directors, managers, process engineers, R&D engineers working in the areas of IC packaging to keep up to date on new assembly process and technology. In addition, the course is useful for sale or application engineers who supply packaging materials and tools to the industry.
Scope
- Principles in the evolution of IC packaging and how the semiconductor industry has evolved to heterogeneous integration with time through Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc
- Principles of Key assembly processes ranging from TAB, Wirebond to various Flip Chip bonding, Encapsulation to Board assembly
- Overview of interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging
- Material characterization from bulk to interfaces for Microelectronics packaging
Course Details
1. Overview of Packing Trend
1.1 Functions of Packaging
- Mechanical, Materials, Electrical and Chemical
1.2 Packaging Trend
- BGA, CSP, Fan-in & Fan-out WLP, 3D packaging, SOC versus SinP, etc
1.3 Challenges in Assembly and Packaging
2. Key Assembly Processess
2.1 Assembly Process Overview
- Leadframe and organic substrate assembly processes
2.2 Die attach & its materials
- Die attach, eutectic bonding, DA materials, Collets
2.3 Wire Bonding & its materials
- Ultrasonic, Thermocompression, Thermosonic mechanisms
2.4 Flip Chip Bondings
- Thermocompression, C4, Re-cap reflow, soild-state, ACF, Conductive paste bonding
2.5 Encapsulation & its materials
- Mold constitutes and properties, transfer, film and compression molding, dam and fill
2.6 Board Assembly & solders
- Solders and its constitutes, Ternary SnAgCu phase diagrams, Intermetallics & Growth
3. Packaging Materials
3.1 PCB Technology
- Materials properties, PCB fabrication processes drilling, patterning, plating, solder resist, laminating
3.2 IC Carriers
- Design rule, Leadframe, LTCC, Flex and BT substrates
4. Material Characterization Techniques
4.1 Introduction
4.2 Bulk Material Characterization
- Stress Strain, Bending, Impact Toughness, TGA, DSC, TMA, DMA
4.3 Interfaces Characterization
- Failure mode and strength
- Wire pull, Ball pull, Double Cantilever Bending
- Die shear, Mold button, shear, Ball shear
Batu Kawan Industrial Park - Penang
- A comprehensively planned industrial park with high standard infrastructure facilities.
- New township
- Strong support from the State Government, PDC & investPenang
- Excellent location and accessibility. Straight to Airport via second link and straight to Port through North South Highway
The industrial land in Kulim Hi-Tech Park consist of a total of 4 phases which accomodates high-technology related industries, with research and development (R&D) and business functions. The industrial land is a ready prime land with class infastructure and 34 major industrial tenants, 6 research and development tenants and approximately more than 30 supporting tenants with from a balance eco-system within the park.
Saigon Hi-Tech Park - Ho Chi Minh City [Hi-Tech Heartland]
After 11 years of development, as one of the only three national hi-tech parks and one of Ho Chi Minh City's five focal projects serving as the driving force for the city's development unitl 2015, Saigon Hi-Tech Park (SHTP) has become a trustworthy destination for hi-tech investment in Vietnam. Towards 2020, SHTP is to be a technopolis playing an important role of strongly enhancing the technological and intellectual base of Ho Chi Minh City (HCMC) and the Focal Economic Region of Southern Vietnam, and serving as a Vietnam's model of technological innovation, intellectual capital development and innovation economy.
More information will be shared in due course.
SEMI Southeast Asia is pleased to announce our collaboration with MATRADE on the International Sourcing Program (INSP) which is a One-on-One Business Meeting scheduled to be held on 8 May 2019 at MITEC, Kuala Lumpur.
Foreign buyers who are selected to attend this programme are entitled for complimentary accommodation (up to 3 days 2 nights stay from 7-9 May 2019) including airport and hotel transfers. This privilege is based on first-come-first-serve basis.
- Hosted Buyers are advised to arrive in Kuala Lumpur International Airport (KLIA) by 6 May 2019
- Hosted Buyers who intend to stay longer (after 9 May 2019) for follow up meetings, will have to bear their own expenses for the additional night's stay as well as own ground transportation and transfers
- Application to participate in this programme is subject to approval by MATRADE and successful participants will be notified officially by MATRADE
To register your interest, please contact Ms Linda Tan at ltan@semi.org or +65.6339.6361
Proudly brought to you by :-
* Programs and Topics are subject to change without prior notice
* Malaysia companies are entitled to HRDF 100% Claimable
Synopsis: Semiconductor industry leapfrogged beyond expectation and set a new milestone in of semiconductor revenue of more than USD400 billion in 2017. Indeed 2017 was a record-setting year for the entire semiconductor supply chain industry with growth expected to continue into this year as new semiconductor applications for the industrial, automotive, artificial intelligence, and consumer markets proliferate at an ever-increasing rate.
In this half a day Market Trend forum, subject matter experts from the chip makers, market research analysts covering equipment and materials, applications domain and advanced packaging space as well as financial analyst will share with you the latest current industry trends and drivers for 2019 and beyond.
*Programs and Topics are subject to change without prior notice
*Malaysia companies are entitled to HRDF 100% claimable
Theme: Internet-of-Things Impact on Semiconductor Testing
Synopsis: The evolution of Internet has given rise to quick access of data, transformed into useful info and then generate actions that affect our daily lives. The data are collected from “Things”, in the IoT sense, a variety of devices with wide spectrum of applications such as medical applications, artificial intelligence, automotive sensing and more, connecting to billions of devices.
To be able to handle these devices connected to the network, the transformation of 4G to 5G network would come faster than we can ever imagined. In the next generation of network, it would couple with many standards to address different needs.
As you examine closely, not only connectivity of the network would be complex, the system requirements such as CPU speed, power consumption, DFT and DSP, many of these devices would be ever demanding technologically and commercially to manufacture them.
In this forum, the speakers from the industrial leading companies would give the audience the insight, and address the challenges in test that we might face as we are transforming into a the era of the connected information.
Mr. Geoffrey TAN
Director
Self Start-Up Company
Synopsis
The course introduces SMT process and back-end assembly with understanding of the terminologies in SMT with acquisition of SMT materials and equipment. Introduction to the industry standard used which is IPC, JDEC and MSL and SMT defect process trouble-shooting guides would be taught in the class well.
What You Will Learn
- SMT process flow
- Stencil design
- Solder paste printing
- Pick and place
- Reflow soldering
- Printed circuit board manufacturing
- SMT process defects and remedies
Course Content For Day 1
1. Basic SMT Process Flow
Direct and indirect materials used in SMT
- Solder paste, epoxy, fluxes, cleaning chemicals, under fills, ACP, active and passive devices
- Chemical, mechanical and physical properties
- Bill of material, technical data sheet, and material safety data sheet
Process Flow of SMT Hybrid
- Single sided, double sided, high mix hybrid assemblies and the FA tree analysis charts
Component identification and size
- Imperial and metric systems on chips as well as IC packages terminology and nomenclature
Solder paste type and particle size
- SAC305,405 and low temperature paste as well as type 1-6 particle and fluxes type (RA,RMA,WS)
- Latest technology on solder paste Game- Changer manufactured by Henkel
2. Stencil Design
Stencil selection, types like laser cut, E-form, etc., fabrication methodology, design aspects and area ratios and 3D stencil for solder paste and glue
Group Work: Cold Sweat United Airlines - Taguchi Fishbone Diagram
3. Solder Paste printing
Machine overview
- Types of printer air bag and open type printers, solder paste jetting, and dispensing
Squeegee materials and selection
- Metal vs rubber squeegee, Rheometric pump squeegee
Solder paste printing
- Stencil vs solder paste printing design guidelines
Setup and operation
- Printer parameter settings and overview on Taguchi fishbone diagram on printing setup
4. Pick and Place Process
Types of mounters
- Modular, rotary turret, and single axis mounters
Selection criteria in selection of a mounter
- UPH, maintenance easibility, spare parts, ROI and interchangeability features of a mounter
Key criteria for a good mount
- IPC 610A Std and JDEC
Mr. Geoffrey TAN
Director
Self Start-Up Company
Synopsis
The course introduces SMT process and back-end assembly with understanding of the terminologies in SMT with acquisition of SMT materials and equipment. Introduction to the industry standard used which is IPC, JDEC and MSL and SMT defect process trouble-shooting guides would be taught in the class well.
What You Will Learn
- SMT process flow
- Stencil design
- Solder paste printing
- Pick and place
- Reflow soldering
- Printed circuit board manufacturing
- SMT process defects and remedies
Course Content For Day 2
5. Reflow Soldering
Types of reflow soldering ovens
- Forced convection, IR and vapor phase reflow ovens, 5-12 zones ovens pros and cons
The 4 components of the reflow profile
- Preheat, soak, reflow, cool process, specs and solder joint defects related to profile (pop-corn, grainy joint, cold solder)
Profiling methd the key consideration
- Types of reflow profile, i.e. linear, flat top or conventional ramp, soak, spike.
6. Printed Circuit Board Process Manufacturing
Types of PCB
- CEM1, CEM2, FR4, BT substrate
Types of PCB plating
- ENIG, electroplating, copper plating, HASL, ENTEC
Plating thickness measurement
- XRF principles and measurement of plating thickness
7. PCBA Rework Methodology
- Type of BGA, IC Rework machine and nozzles
- Methodology of BGA Rework
- Profile for rework
8. PCBA Cleaning
- Types of chemicals used in cleaning PCBA (solvent, aqueous and DI Water)
- Types of cleaning machine(ultrasonic, centrifuge, spray jet etc.)
- Cleanliness check using contact angle, bond pull, high mag, etc.
9. SMT Process Defects and Remedies
- Identifying the typical SMT defects related to the 6M i.e. Man, Machine, Methods, Materials, Mother nature (environment) and measurement.
- Remedial and correction of the above defects together with process optimization.
Synopsis
South East Asia is a vibrant hub of electronics manufacturing. From IC’s, components and micro assemblies to finished consumer and industrial electronic products, Southeast Asia is a major supplier meeting the demands of the world markets. With excellent IP protection, to deep manufacturing know-how and a competitive engineering talent, foreign direct investments for the electronics segment has grown significantly over the years. The fact that Southeast Asian countries also offer the twin benefits of geographical proximity to major markets like China and India and relatively low labor costs, further help in making countries such as Malaysia,Vietnam, Thailand and Philippines natural homes for foreign high tech manufacturers wanting to relocate their Asian bases.
With recent global uncertainty development especially in the emergence of global protectionism policies, there is strong indications that electronics manufacturers are deeply evaluating mid and longer term impacts of these measures and are seeking a deeper understanding of the attractiveness of Southeast Asia’s High Technology Parks in the region.
SEMICON SEA’s Southeast Asia Investment forum is intended to provide global electronics players a platform to understand the technology parks in the region and aspire to provide an overview of the incentives and policies that is shaping the electronics segment development in these countries. This year we are delighted to have representation from Vietnam, Malaysia and Philippines as well as banking institutions as well as legal to speak on the broad incentives and FDI structuring for FDI into the electronics manufacturing sector. In addition, through SEMICON Southeast Asia, there will also be a platform to assist potential delegation in a business mission visit to participating High Technology Industrial Parks.
* Programs and Topics are subject to change with prior notice.
* Malaysia companies are entitled to HRDF 100% Claimable.
Theme: What it takes to transform -- Smart Manufacturing Environment
Synopsis: What does Smart Manufacturing mean for the future of the electronics manufacturing supply chain? The electronics manufacturing supply chain holds many different perspectives, but one thing is clear - the impact of Smart Manufacturing will be huge.
Recent advances and low-cost technologies for sensing, connecting, and analyzing masses of data has push the boundary of next generation of disruptive improvement in even the highly sophisticated world of semiconductor and electronics systems manufacturing. Advanced automation and sensing technology coupled with highly sophisticated advanced data analytics now offer the manufacturing sector an opportunity to better integrate automation and structural data from separate silos to drive actionable and optimized manufacturing efficiencies.
The Technology Innovation forum on smart manufacturing keynotes from leaders across the electronics manufacturing supply chain offers relevant and thoughtful insights of how Smart Manufacturing is revolutionizing the electronics manufacturing environment.
SEMICON SEA 2019 Workforce Development Activities
SEMI is a not-for-profit global trade association. The primary mission of SEMI is about developing thought leadership and fostering talent development with the utopian vision of facilitating the development of the electronics and semiconductor industry. SEMI Southeast Asia brings that advocacy initiatives in focus for the Southeast Asia regions and endeavours to enable a growing, technologically adept and resilient engineering communities in the region. Talent shapes the E&E industry. Innovations in any industry is dependent on human ingenuity and more so, the sustenance of the industry hinges on influx of new graduating talents.
Click HERE to download a copy of the WFD agenda happening at SEMICON SEA 2019!
In today context, STEM interest and engineering enrolment is in sharp decline. One of the major advocacy initiatives that SEMICON Southeast Asia organises is the Workforce and Talent Development Pavilion. In answering the call for action on promoting STEM in our young, SEMI will be conducting the award-winning SEMI High Tech U program for secondary school children. Participant to the program will be exposed to the world of science and maths that define the high technology semiconductor electronics to spark STEM interest in our young. In addition, we will also be hosting a “Woman in Engineering Panel” to encourage diversity in engineering enrolment and career choice. To top that of, the pavilion will also showcase an engineering career fair. The target is to host at least 20 semiconductor hiring companies for graduating students from universities and polytechnics.
We invite you and your company to be part of the SEMICON Southeast Asia Electronics Manufacturing Career Fair!
Of the diverse advocacy activities that SEMI Southeast Asia engages in, one of the salient activities would be on Talent Pipeline Development initiatives. With support from the Industry Talent Management division from MIDA, SEMI Southeast Asia will be organizing a Career Fair in tandem with our annual SEMICON Southeast Asia event held from 7th to 9th May 2019 in Kuala Lumpur.
Download a copy of the Electronics Manufacturing Career Fair 2019 Info Package HERE
Download a copy of the Electronics Manufacturing Career Fair 2019 Application Form HERE
Please click HERE for the online Floorplan.
For more details, please contact Linda Tan - ltan@semi.org / +65.6339.6361 or Natalie Ong - nong@semi.org / +65.6391.9517
Smart technology and connectivity are increasingly pervasive in our lives, with devices we use to make our lives faster, easier, and more efficient. Consumer products such as smartphones, smart cars and wearable technology are just a small part of how the Internet of Things (IoT) is quickly becoming widespread, with the demand set to grow exponentially. This segment will be featured prominently at the up-coming SEMICON Southeast Asia 2019 exhibition.
World-of-IoT Pavilion is a showcase of regional players domain expertise in creating new Tech gadgets with the fundamental of semiconductors. It serves to promote and encourage Tech entrepreneur-ship in SEA. This is a golden opportunity for start-up companies to showcase their electronics gadgets including teardown of consumer products to the electronics manufacturing supply chain community at one single platform.
Be part of the World-of-IoT pavilion, witness the enablement of semiconductor and the exponential potential to empower our smart lifestyle. Bringing together all of Southeast Asia tech entrepreneurial resources from across the region into one place, at one time.
Join us today at the World of IoT Pavilion!!
For just SGD200 participation fee, you will get to enjoy the following:
- A kiosk of approx. 3m x 2m (6sqm) which includes standard furniture for you to showcase your products
- Special highlights on Tech Start-up companies in the printed show guide which will be distributed at the show
- A dedicated media tour during the show
- Promotion via Electronics Direct Mailers (EDMs) on Tech Start-up & World of IoT
- Network with semiconductor C-level that matters
World-of-IoT Pavilion Information Package
World-of-IoT Pavilion Application Form
World of IoT Kiosk Visual
For more details, please contact Natalie Ong - nong@semi.org / +65.6391.9517
