Thought Leadership Exchange at SEMICON Southeast Asia 2020
SEMICON Southeast Asia is the ideal place to discover the technologies and trends that are driving advances in microelectronics to electronics manufacturing. From our series of technology and business forums, to conversations with our exhibiting companies, you will find ideas and solutions to your challenges, meet the people you need to know, and take away the information you need to advance your projects, innovations, and companies into the future.
The SEMI Southeast Asia Team works closely with their supporting committees and the manufacturing and R&D organizations to develop programs to match the specific needs of Southeast Asia's microelectronics and electronics ecosystem.
Learn insights from renowned international technology leaders and make an impact by presenting your technical solutions at the following technology symposiums
CxO Speaks 
Theme: Transforming Technologies into Smart Solutions
2020 is the beginning of a new and exciting decade for innovation, transforming technologies into smart solutions. This era of industrial 4.0 and 5G connectivity offers many growth opportunities to transform industries and shape the future of advanced manufacturing and production. We invite high profile industry leaders in SiP, IC design, memory, wafer fabrication, packaging and testing and Minster from Trade Industry to share the opportunities in the cutting-edge technologies such as 5G, artificial intelligence , big data analytics and World of IoT.
Technology Innovation Forum - 
Theme: Digitalization in the New Era of Manufacturability
Digitalization is powering innovation in the high-tech manufacturing, we witness the vast benefits it brings to the early adopters, with significant improvement in product quality, manufacturing efficiency, workforce health and safety, alongside with tremendous potential in skillset upgrading. The process of deriving to smart manufacturing is a journey, but surely a deserving effort.
In this forum, key opinion leaders share their insights on this journey and the various solutions in the key aspects of innovation. Learn the best practices in data security and communication, machine learning with real-time processing methodologies, assets management with profit optimization.
Market Trends Briefing 
The rise of new end-market applications like AI, 5G, IoT leads to the revolutions in semiconductor industry with continuous investment in leading-edge foundry and packaging technologies. Along with the growing investment, the uncertainties triggered by the rising cost of advanced node R&D and global market economy also increased. Industrial 4.0 together with digital transformation is an evolving journey. As the variety of opportunities increases so do customer expectations and digital transformation challenges.
In this forum, we will cover a wide variety of market analysis from application to manufacturing, including an update of trends and drivers shaping these markets, geopolitical implications on business opportunities and challenges.
Advanced Packaging Forum 
Theme: Heterogeneous Integration & Challenges in System Scaling and Performance
As we enter into the era of digital transformation, we witness the disruption in technology with the innovation of smart devices and high performance for data connectivity. Smart data analytics, artificial intelligence & signal sensing will be the key aspects in all applications- in manufacturing, mobility, lifestyles and many more.
Having a super-powered device with multi-functions is an essential in this age, device manufacturability with such integration is the top critical challenge by the manufacturers.
At this forum, we provide a platform for key opinion leaders from the industry to share the best practices and their innovative solutions to overcome these challenges.
Learn the various packaging and assembly techniques that will guide you to resolve your technical challenges and exchange your perspectives at this interactive platform.
Product & System Level Testing Forum 
Theme: Device & System Level Test Challenges and Advancement for High-Performance Applications
Disruptive technologies bring the world into the new era of digitalization. With the rise in demand for such functionalities in applications like automotive, wireless communication and IoT connectivity; stringent test & reliability requirements are expected. Test challenges in automotive System-on-Chips, high-density memory test challenges and emerging technologies such as 5G testing will be discussed in this forum. The forum will explore ways in the aspects on improving test efficiencies, metrology for yield enhancement and data predictability.
The Call for Abstract is now open!
Submit your suggested title with an abstract and biography by 31 January 2020*.
Speakers are encourage to take up exhibit space for further technical discussion and products promotion at the exhibit booths.
For details on Exhibit, please refer to Exhibitor Prospectus
*Note: Presentations are to be non-commercial and focus on technical merits of the solution
Selected speakers will be notified by 21 February 2020
Leverage on this opportunity and demonstrate your solutions at the show floor.
Engage your target audience with live demonstration and secure an in-depth discussion with them at the floor.
Don’t miss out any chance at this annual congregation of high-tech electronics manufacturing ecosystem.