Dr. Lee Teck Kheng received the B.S. degree in mechanical engineering and the M.S. degree in materials science and engineering from the National University of Singapore in 1995 and 1999, respectively and the Ph.D. degree in Mechanical and Aerospace Engineering from the Nanyang Technology University, Singapore, in 2006. He had been with the semiconductor packaging industry for eighteen years, working from the historical package of DIP to the recent flip-chip packages, WLCsp and system-in-package. He joined the Institute of Microelectronics (IME), Singapore, in 1997, researching in the areas of MEMS, CSP, and flip-chip packaging. In 1999, he joined Micron Semiconductor Asia Pte Ltd as a Senior Technical Member, responsible for substrate supplier management and leading some research programs in the field of advanced packaging and material characterization.
He is currently the director of Technology Development Centre for ITE College Central, leading a team of engineers and researchers to support the industries in Semiconductor, Automation, ICT and electronics sector. He has authored and co-authored more than 60 journal and international conferences papers. Currently, he holds 66 U.S patents, pending another 10 patents from issuing. He has/had served as a committee member for EPTC, SSIA, SEMI, SCCCI and ICMAT conferences. He is also listed as Who’s Who in the World 2013-2018 as well as listee of IBC Leading Engineers of the World since 2013-2016. Currently, he acts as co-convenor to represent Singapore in reviewing IEC standard for Semiconductor.