Mr. Albert LAN

Global Packaging Senior Technical Director
Applied Materials, Taiwan

Applied Materials – 2 years

  • Albert Lan is taking care of Advanced Wafer Level Packaging Technology Development with customers from process integration points of view for Applied Materials, including Fan Out, 2.5D/3D TSV, SiP(System in Package), and CoW/WoW Copper hybrid bonding.


  • Over 25 years of job experience in semiconductor industry, especially focusing on advanced wafer level packaging technologies.
  • Senior Engineering Center Director, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  • Product Development, Quality, & Sales, 6 years, Amkor Taiwan(Bumping)
  • Vice Chairman of SEMI Taiwan PKG&TEST Committee.
  • Chairman of TILA (Taiwan Intelligent Leader Association).
  • Published more than 50 technical papers and granted more than 20 issued worldwide Patents.


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