Albert Lan is taking care of Advanced Wafer Level Packaging Technology Development with customers from process integration points of view for Applied Materials, including Fan Out, 2.5D/3D TSV, SiP(System in Package), and CoW/WoW Copper hybrid bonding.
Over 25 years of job experience in semiconductor industry, especially focusing on advanced wafer level packaging technologies.
Senior Engineering Center Director, 13 years, SPIL, which is top 3 biggest assembly house in the world.
Product Development, Quality, & Sales, 6 years, Amkor Taiwan(Bumping)
Vice Chairman of SEMI Taiwan PKG&TEST Committee.
Chairman of TILA (Taiwan Intelligent Leader Association).
Published more than 50 technical papers and granted more than 20 issued worldwide Patents.