Eric NG, has been in business development position at ASMPT for over 4 years, with responsibility of product marketing and development in advanced packaging sector. His main responsible area includes advanced interconnect business such as flip chip bonding, TCB bonding, Fan-out wafer and panel level packaging. Prior to join ASMPT, Eric was in engineering position for product development in semiconductor industry. Over his previous more than 15 years’ experience, Eric spent time doing process and product R&D including FPC (flexible printed circuit), package assembly and thermal cooling solution for package device.
Eric received his Bachelor and Master degree in Mechanical Engineering field from Hong Kong University of Science and Technology.