John P. Almiranez is a licensed Electronics and Communication Engineer, graduate of Polytechnic University of the Philippines. He worked with Philips Semiconductors in Philippines for 12 years being a Sr. Process Engineer as his last position. In 2004, he joined Universal Instruments and based in Shanghai, working as a Sr. Process and Laboratory Engineer. His main function includes prototyping of advanced packaging assembly such as SiP, Stacking Assembly and PoP as well as 01005 assembly. He also conducted failure analysis of assembled electronic packages, held technology workshops and seminars and performed assembly process investigation and audit.
Currently, he is the Business Development Manager for Advanced Packaging Assembly Solution under the SEA Team of Universal Instruments Corporation. He became involved in the assembly and process development of UIC solution for direct and flip chip die attach, package-on-package, CPV-type solar assembly and large panel wafer level packaging.
For many years now, he was conducting presentation in various symposia and technical conferences to share with packaging and assembly houses new concepts and ways of die-level and component-level packaging technique.