Director of Packaging Development, Infineon Technologies (Malaysia) Sdn. Bhd., Melaka, Malaysia. Graduated from The University of Science Malaysia (USM), Penang with Bachelor of Technology. More than 20 years of experience in Backend Assembly and Test Semiconductor Industry (Power and Discrete IC). Having cross functional leadership experiences: Failure Analysis & Reliability, Quality Engineering, Manufacturing Engineering and Packaging Development. Packaging development primarily focus in RF mobile application, consumer sensing, automotive sensor & control and package miniaturization in automotive power supply and network ICs.