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Mr. Nelson WONG

Senior VP – Ball Bonder Business Unit
Kulicke & Soffa Pte. Ltd.

Nelson had been working in semiconductor packaging for more than 30 years.  He is currently the Senior Vice President of Ball Bonder Business Unit at Kulicke &Soffa.

Nelson joined K&S in 1997 as Application Manager before moving on to lead the Ball Bonder Product Management team.  He progressed to manage the ball bonder business unit. Prior to joining K&S, Nelson was the Process and Packaging Engineering Manager at STMicroelectronics involved in package development.

Nelson holds a MBA and a B.Sc degree in Physics from National University of Singapore.

 
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