Nelson had been working in semiconductor packaging for more than 30 years. He is currently the Senior Vice President of Ball Bonder Business Unit at Kulicke &Soffa.
Nelson joined K&S in 1997 as Application Manager before moving on to lead the Ball Bonder Product Management team. He progressed to manage the ball bonder business unit. Prior to joining K&S, Nelson was the Process and Packaging Engineering Manager at STMicroelectronics involved in package development.
Nelson holds a MBA and a B.Sc degree in Physics from National University of Singapore.
Mr. Nelson WONG
Senior VP – Ball Bonder Business Unit
Kulicke & Soffa Pte. Ltd.