Mr. Thomas Gregorich is Director of Business Development at ZEISS Semiconductor Manufacturing Technology where he is responsible for 3D imaging products which support Advanced Packaging. Previously Mr. Gregorich held senior-level positions at Western Digital, Micron, Broadcom, MediaTek and Qualcomm. At Micron Mr. Gregorich qualified the Company’s first commercial TSV product. While at Qualcomm he established the Package Engineering department and for 12 years led the development of Qualcomm’s small form-factor package portfolio including NSP, CSP, BCC, QFN, POP and PIP. Prior to his position at Qualcomm, Mr. Gregorich worked for Motorola and had assignments in the Semiconductor Products Sector and Corporate Research, both in the United States as well as Japan, Taiwan and China. Mr. Gregorich has a BS in Mechanical Engineering from Bradley University, an MBA from Northern Illinois University and is a Senior Member of IEEE.