Agnes Lesage is the Research and Development head of Infineon Technologies Singapore since July 2014. Her expertise as R&D Head for IC Packaging includes 18 years of international exposure in the Semiconductor Industry. Agnes had successfully restructures, trained and expanded the Packaging R&D team to support the fast pace growing Automotive and Industrial business. Her career with Infineon Technologies began almost 2 decades ago as product engineer in wafer fab. To date, she has steered several technologies ramp-up and has successfully transferred various product portfolio from Germany to France, Malaysia, Taiwan and China. She has championed and managed the Powertrain Product Portfolio within the Infineon Technologies Automotive division. Her leadership style with an in depth Asian cultural understanding has been the key for her to lead various cross-functional team to drive cost improvements and quality initiatives ensuring business success. Agnes Lesage graduated in France from ISMRA-ENSICAEN as Micro-Electronic Engineer.