Ai Kiar, Ang obtained her Masters of Technology Management and Degree of technology and education, majoring in Electrical Engineering from University of Technology Malaysia. She joined Texas Instruments, Malaysia in year 2004 as a Process Engineer for process and yield improvements. From year 2005-2008, she joined Intel Technology, Malaysia as Product Development Engineer responsible for Intel’s Mixed Signal Products test development. She obtained Intel Malaysia Site Recognition Award Q4’06 and Intel Test Operation Department Award Q3’06 for developing quad site testing. In year 2009, she joined Intel Micron Flash in Singapore, as a Functional Probe Engineer responsible for 60 series 300mm wafer test program development. She later joined IBM’s Integrated Supply Chain (ISC) organization as a Component Test Engineer in Component Procurement Engineering from 2009. Her primary role is component owner and test subject matter expert, where she is responsible for managing component parts and suppliers. She is an instructor who delivers a few internal trainings as well as certified Lean Six Sigma Green Belt. Ai Kiar is a member of the IBM Supply Chain Analytics Center of Competency (CoC), recently launched in collaboration with Singapore’s Economic Development Board (EDB). The centre is dedicated to develop analytics-based technologies in order to help organizations improve their supply chains. She has two accepted papers which co- author submission for “Device Sensitivity to Post Solder Attach Processes” and paper was presented in SMTA Surface Mount Technology Association as well as paper submission “ESD Levels and Trends for Advanced Memory Technologies" in ESD/EOS Symposium.