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Technology Innovation Forum 2017

Kindly note only presentation slides with explicit permission from the speaker are shared below to the registered attendees.

Due to confidentiality, some speaker may not be able to share their presentation materials. We seek your kind understanding. 

Some presentation slides may still be pending for speakers' internal approval. Please come back here again by early June to check for further updates.  
 

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Wednesday, 26 April 2017 | 10:00 – 15:30hrs
SPICE Arena (Conference Room 4 & 5, Level 2), Penang, Malaysia

Organised by:

Supporting Partner:

 

     

 

Sponsored by: 

 

 

        

                                                                                                                             

Theme:

Industrial Internet of Things: Unlocking the Potential by Semiconductor Companies

 

Abstract:

Industrial Internet of Things (IIoT) is poised to usher in a fundamental transformation in the man-machine interaction. It promises to bring about a significant transformation in manufacturing and other industrial sectors of the economy. It offers a tremendous economic potential and impact.

The unlocking of which also brings up various important questions like: How does this impact the existing industries, business models, value chains, work forces? What are the challenges? And where are the opportunities - the real value points for us in the semiconductor industry?

Join us at the SEMICON Technology Innovation Forum 2017 to get ideas and insights into how various key players are positioning themselves to unlock the potential of IIoT. Get access to some amazing speakers, insightful content and exclusive networking.

Target Audience:

  • Industry leaders with stake in the semiconductor ecosystem
  • ​Analysts
  • Startups, Venture Capitalists

Theme for Panel Discussion: Industrial Internet of Things: Opportunities and Challenges for Semiconductor Companies

 

 

 

 

  Session Chair:
  Ms. Meenu SARIN

  Director, VLSI Consultancy, Singapore

 

Time

Presentation 

 

10:00-10:15

Welcome Remarks by Session Chair
 

10:15-10:45

Transforming 200mm Fabs Through Automation
Mr. YAP Ah Choi, Manager, Automation Engineering, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore

[PRESENTATION] 2.05MB 
 

10:45-11:15

A Highly Integrated and Comprehensive SiP Solutions for IoT
Mr. Teck LEE, Senior Technical Manager, Corporate R&D, ASE Group, Taiwan
[PRESENTATION] 1.35MB 
 

11:15-11:30

Break & Networking Time
 

11:30-12:00

Implementing IIoT using SEMI Standards – A Platform Based Approach
Mr. Ranjan CHATTERJEE, Vice President, Emerging Business & Technology Office, Cimetrix, USA
 

12:00-12:30

Opportunities and Challenges in End-to-End IoT Deployment
Dr. Thomas OOI, Solution Enabling Manager, Intel , Malaysia

 

12:30-13:30

Conference Lunch
 

13:30-14:00

Enhancing Capital Efficiency and Fab Productivity for IoT Applications
Dr. David HAYNES, Senior Director, Business Development, IoT Solutions in the MEMS and Advanced Packaging business group, Lam Research Corporation, USA

 

14:00-14:30

Enabling IoT Era, through Packaging Technology Innovations
Mr. Sivakumar MOHANDASS, Senior Director, Sales, Amkor Technology,  Singapore

 

14:30-15:15

Panel Discussion: Industrial Internet of Things: Opportunities and Challenges for Semiconductor Companies

Moderator:
Ms. Meenu SARIN,  Director, VLSI Consultancy, Singapore

Panelists:

  • Mr. Sivakumar MOHANDASS, Senior Director, Sales, Amkor Technology,  Singapore
  • Mr. Teck LEE, Senior Technical Manager, Corporate R&D, ASE Group, Taiwan
  • Mr. Ranjan CHATTERJEE, Vice President, Emerging Business & Technology Office, Cimetrix, USA
  • Mr. YAP Ah Choi, Manager, Automation Engineering, GLOBALFOUNDRIES Singapore Pte Ltd, Singapore
  • Dr. Thomas OOI, Solution Enabling Manager, Intel , Malaysia
  • Dr. David HAYNES, Senior Director, Business Development, IoT Solutions in the MEMS and Advanced Packaging business group, Lam Research Corporation, USA
  • Mr. Ayo KAJOPAIYE,  Project Coordinator, Collaborative Technology Platforms, SEMI (HQ), USA
     

15:15-15:30

Closing Remarks by Session Chair

 

Program subject to change without prior notice. 

 

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