Mr. Samuel GOH

Samuel joined Kulicke & Soffa in the year 2014 as a Senior Director of the Advanced Packaging business unit. In his role, he is responsible for the business development of the Advanced Packaging product portfolio and has successfully led the business unit to penetrate TCB market segment for key global customers. As an industry veteran, Samuel has 28 years of project and product management experience in the mid to large-scale capital equipment industry. Before joining K&S, he held positions in various companies such as KLA-Tencor and Flextronics.

Most recently, he was appointed as the Chairman of the Advanced Packaging Forum for SEMICON SEA 2023.

Samuel holds an Honors Bachelor’s degree in Mechanical Engineering from the University of Sheffield.

Presentation Title

Addressing Fine Pitch Bonding Challenges via Fluxless TCB

Abstract

Fluxless Thermo-Compression Bonding (TCB) faces challenges in achieving reliable interconnects, especially with ultra-fine pitch and larger die sizes, for both chip-to-substrate (C2S) and chip-to-wafer (C2W) processes. A primary concern, particularly in C2S, is managing differing thermal expansion rates between the chip and substrate, which can cause warpage-induced stress and connection failures. Kulicke & Soffa addresses these challenges with innovative solutions like their APTURA™ platform. This system is engineered to handle warpage effectively while delivering production-ready fluxless TCB. Kulicke & Soffa has also demonstrated its capability in shipping a significant number of TCB machines in the past two years, indicating strong adoption of their solutions. APTURA™ employs processes like in-situ formic acid vapor application for oxide reduction. These machine capabilities improve interconnect integrity, eliminate flux-related contamination, and support the increasing demands of advanced packaging for high-performance computing in complex C2S and C2W assemblies.

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