Mr. Steve JIN

Steve JIN has 25 years of experience in advanced packaging industry. He is familiar with WLP, SiP and optical module. He is also the pioneer of Cu pillar bump and FOWLP technology in Singapore. He has 8 years working experience in Apple Singapore, and 7 years of experience in STMicroelectronics.

Presentation Title

Next-Gen 3D Self-Power AI Module by Novel Fan-Out Structure

This work presents a next-generation 3D self-powered AI module enabled by Fan-Out Panel-Level Packaging (FOPLP). By vertically integrating photovoltaic (PV), power management, and AI compute into a single System-in-Package, the proposed architecture shifts power delivery from board-level to package-level. Compared to traditional discrete power trees with 20–35% losses, the OIP approach reduces losses to below 10% through ultra-low resistance interconnects and thick copper routing.   The platform supports dense 3D chiplet integration with improved thermal performance, enabling compact, energy-efficient solutions for AI-in-space, edge computing, and advanced consumer electronics applications.

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