Mr. Choon Khoon (CK) LIM

Lim Choon Khoon (CK) is a Senior Vice President and Chief Counsel for Advanced Packaging (AP), Semiconductor Solutions.

CK guides and advises the Semiconductor Solutions leaders on AP, including advocacy, trend-scouting, and technology collaborations. His distinguished career in the semiconductor industry spans decades of experience across engineering, manufacturing, and key management roles.

CK holds a Bachelor of Science (Honours) in Production Engineering and Production Management degree from the University of Nottingham, United Kingdom.

Keynote 

Driving Bonding Technology with Four Fundamental Pillars in Mind: Materials-Process-Equipment-Metrology

The challenges of advanced packaging are well translated into key development areas in bonding technology, which is the foundation of inter-device and device-substrate interconnectivity. At ASMPT, bonding technology is looked at as a holistic topic, which contains the four critical pillars of development. Materials, process, equipment, metrology are all key players in the establishment of a capable and robust bonding technology. This presentation will discuss the importance and interactions between these pillars, to enable ASMPT’s bonding technology for generations to come. Examples will be described, to demonstrate the importance of such interactions. To make this journey successful, the necessary cross industry collaborations will be discussed.

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