Mr. Rich HUENERS

Rich Hueners brings 17 years of backend semiconductor equipment experience and currently is the Chief Commercial Officer of Palomar Technologies, responsible for driving the global strategic and commercial vision and roadmap for Palomar’s core automated microelectronic packaging and high-precision assembly business. His oversight spans key growth markets across North America, Europe, and Asia, where he focuses on scaling high-precision assembly solutions for complex applications in data communications, automotive LiDAR, aerospace and defense and medical device technologies.

Presentation Title

Precision at Scale: The Back-End Roadmap for Glass Interposers in Co-Packaged Optics & RF mmWave

As front-end scaling encounters the physical and economic "reticle limit," the semiconductor center of gravity has shifted. In 2026, performance gains and market differentiation are no longer dictated by the wafer alone, but by the sophistication of the Advanced Packaging architecture. 

However, this transition to high-frequency CPO and RF mmWave applications has exposed the thermal and mechanical limitations of legacy organic substrates—specifically, catastrophic warpage and signal loss that cripple HVM (High Volume Manufacturing) yields. This presentation explores the transition to glass-core substrates and glass interposers as the definitive solution to the "Thermal Battle." 

We will analyze how glass provides the dimensional stability and electrical performance required for the next generation of AI accelerators and 6G infrastructure. Crucially, we will outline the necessary paradigm shift in back-end assembly platforms, moving beyond traditional boundaries to achieve true precision at scale.

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