Mr. Mark Gerber
Senior Director, Technical Marketing ASE (US) Inc
Presentation Title
Advanced Packaging: Enabling a New Generation of Silicon Systems
Presentation Abstract
Demand for new efficiencies in the semiconductor design and manufacturing process is propelling the crucial role of packaging to deliver on requirements related to power, performance, and miniaturization. During his presentation, Mark Gerber will explore the heterogeneous integration and chiplet era, and describe how advanced packaging technologies are enabling highly complex system integration solutions across automotive, HPC, sensor and mobile markets. He will then turn his attention to delve deeper into regional market and technology nuances and the packaging creativity accelerating a smarter and more sustainable world for generations to come.