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Charles Lee

Mr. Charles Lee

Director of Engineering and Technical Promotion ASE Inc

Charles Lee is Director of Engineering and Technical Promotion at ASE Inc. He is responsible for customer engagement through engineering and technical marketing, as well as the promotion of ASE’s technology across the industry.

Charles has over 25 years of semiconductor industry experience including various roles in leadership, management, technology development, sales and marketing. His expertise includes materials characterisation, robust package design, assembly technology, failure analysis, automotive and power electronics. Prior to Joining ASE, he was Strategic Marketing Director at IME (Institute of Microelectronics, Singapore) and Principal of Material Science at Infineon Technologies Asia Pte Ltd, heading the Global Technology Development Centre.

 Charles is a Senior Member of IEEE and a recipient of the 2001 IEEE/CPMT Society Outstanding Young Engineering Award. He served many years on the IEEE REL/CPMT/ED Singapore Chapter, EPTC (Electronics Packaging Technology Conference) and ECTC (Electronic Components & Technology Conference) Interconnect committees. He has written more than 60 technical papers and holds over 10 patents. Charles graduated from the University of New South Wales, Australia with a Master of Applied Science degree in Materials Science and Engineering.

Presentation Title

Advanced Packaging: Enabling a New Generation of Silicon Systems.

Presentation Abstract

Demand for new efficiencies in the semiconductor design and manufacturing process is propelling the crucial role of packaging to deliver on requirements related to power, performance, and miniaturization. During his presentation, Charles Lee will explore the heterogeneous integration and chiplet era, and describe how advanced packaging technologies are enabling highly complex system integration solutions across automotive, HPC, sensor and mobile markets. He will then turn his attention to delve deeper into regional market and technology nuances and the packaging creativity accelerating a smarter and more sustainable world for generations to come.

 

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