Mr. Lee Chee Ping
Technical Director Lam Research
Lee Chee Ping is the Technical Director from Lam Research, focusing on the heterogeneous integration segment. He has more than 19 years of experience in semiconductor industry, of which 13 years are related to advanced packaging. He has led worldwide field process teams and worked closely with customers on various 2D/2.5D/3D technologies development and qualification. He also engages the microelectronics supply chain from fabless players, IDMs, OSATs to equipment & material suppliers on technical exchanges and collaborations. In view of his deep understanding of this segment, he now oversees advanced packaging market analysis and technology trends mapping, along with technical marketing of Lam’s wafer level equipment solutions. He has presented at multiple advanced semiconductor packaging conferences.
Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.
Presentation Title
Innovative Equipment Solutions for Chiplets Re-integration
Presentation Abstract
The semiconductor industry is undergoing a transformation with the emergence of chiplets, which are small modular chips that can be combined to create more complex systems. This new approach to chip design allows for greater flexibility, cost savings, and faster time-to-market. However, integrating these chiplets into a cohesive system presents new challenges that require advanced equipment technology.
In this presentation, we will explore the emergence of chiplets, outline the key schemes of chiplets re-integration and discuss the equipment technology that enables their reintegration. We will begin by discussing the benefits of chiplets and the market outlook of this approach. Next, we will delve into several packaging methodology used to re-integrate the chiplets, such as the 3D stacking of die to wafer via hybrid bonding and also the high density fanout approaches. Finally, we will explain several innovative equipment solutions by Lam Research, needed to enable these chiplets re-integration