Mr. Nithyananda Hegde
Senior Product Manager BESI
Nithyananda Hegde has a Mechanical Engineering degree, Advance diploma in semiconductor Technology and Masters in Marketing from the University Western Sydney. He has 24 years of experience in the semiconductor industry Front end wafer Fab and backend packaging areas.
Before joining BESI, Nithya worked for Apple, STMicroelectronics, Siltronic and Micron in multiple areas like Engineering, Process & HW development and in RnD area. He then joined BESI 6 years back as a Business development Manager and now is Senior Product Manager for Hybrid bonding. He has participated and is also currently involved in several cutometer & partner development projects including funded gov project.
Presentation Title
Die-to-wafer Hybrid Bonding
Presentation Abstract
Die-to-wafer (D2W) Hybrid Bonding - a More than Moore Catalyst
With the ever increasing complexity in packaging and the shift to chiplets to address many factors such as development time, costs, flexibility to changes and yield amongst others, die-to-wafer (D2W) hybrid bonding has emerged as a disruptive technology offering many benefits; lower sub-micron level bonding accuracies to address smaller technology nodes and tighter bond pad pitches being one of the paramount requirements. D2W hybrid bonding is enabling the continuation of scaling and improving the performance of microprocessors beyond the limits of Moore's Law. Hybrid bonding has been around for many years at wafer level but only recently has D2W hybrid bonding been used in high volumes for the advanced packaging regime.
D2W hybrid bonding brings with it however a new set of requirements when compared to wafer to wafer (W2W) hybrid bonding, and these must be addressed diligently if a successful solution is to be introduced and offered to the market. For die-to-wafer bonding at industrial speeds and accuracy, new placement technologies and deeper understanding of the behaviour and interactions which impact accuracy are essential. This presentation aims at highlighting the process flows for hybrid bonding, findings from actual bonds performed with the BESI ultra accuracy bonder dedicated to Hybrid bonding and accuracies reached, all with a high throughput of up to 2000 CPH
Keywords: hybrid bonding, die to wafer hybrid bonding, high accuracy