Dr. Thorsten Matthias
Regional Sales Director Asia-Pacific EV Group (EVG)
Dr. Thorsten Matthias is Regional Sales Director Asia-Pacific at EV Group (EVG). Prior to this role, Matthias was director of business development at EVG where he was specifically focused on 3D integration, MEMS, LEDs and a number of emerging markets.
He began his career with EVG in 2002 as the product manager for the SmartView wafer bonding alignment system. After that he was director of technology of EV Group North America in Tempe, Arizona.
Matthias received his doctorate degree from Vienna University of Technology with a thesis in solid-state physics in 2002.
Presentation Title
Hybrid Bonding – State-of-the-Art and Upcoming Requirements in W2W and D2W
Presentation Abstract
Hybrid bonding is a key technology for heterogeneous integration. Even though hybrid bonding is not new to the industry, the packaging aspect has not been the focus on any of the PPAC metric. In recent years the system performance is getting more important, where heterogeneous integration and system-technology co-optimization (STCO) are the key building blocks for future devices, especially in high performance, AI and mobile applications.
Over the last decade fusion and hybrid bonding on wafer level has developed and is now readily available as unit process in most foundry and device manufacturers worldwide. In the current industry transformation away from optimization on planar devices towards system integration and towards 3D stacked devices, bonding technologies are playing a crucial role. While most devices such as image sensors or stacked memory have been designed specifically for 3D integration and bonding, the next technology transformation as a universal high-density interconnect technology will also trigger a new integration process. Therefore, wafer-level as well as die-level hybrid bonding technologies are being developed and depending on interconnect density, chip size, system yield and cost, the best fit in terms of integration flow will be selected.
In this presentation we will provide an overview on the current industry trends and technological developments both for wafer-to-wafer as well as die-to-wafer hybrid bonding. Key technology differentiators, integration scenarios are discussed with respect to the hybrid bonding schemes in wafer-to-wafer as well as die-to-wafer integration.