Mr. Yeo Chak Huat - Vice Chairman
Senior Director, Head of Quality & Reliability Assurance GlobalFoundries Singapore
Yeo Chak Huat is a Senior Director at GlobalFoundries, one of the world’s leading semiconductor foundries. GlobalFoundries manufactures complex, feature-rich ICs that enable billions of electronic devices that are pervasive throughout nearly every sector of the global economy.
In his current role as the Head of Quality & Reliability Assurance for the Singapore manufacturing facility, Chak Huat is responsible for meeting customers’ specifications on quality and reliability. He constantly works together with the team to strive for zero-excursion, zero-defect mission in all aspects of the firm’s manufacturing and operations. He is in the Corporate Quality Leadership and Site GM Leadership team.
Prior to this role, Chak Huat was responsible for the Singapore facility’s backend manufacturing and engineering operations, as well as supporting new technology introduction testing, characterization, and qualification for production readiness. He was also the Head of OSAT Operations and Business Management where he managed the worldwide outsourcing business and operation of the company. He oversaw the OSAT business’s revenue growth to $300M, drove the execution of the operation and quality to meet the customer service expectation.
Chak Huat has spent 35 years in the semiconductor industry. His work focuses on a wide range of domains, spanning the technical, business, operational and quality aspects of the industry. His area of expertise includes wafer fabrication, wafer bumping, packaging, quality, product engineering and testing.
Chak Huat holds a bachelor’s degree in Electrical & Electronic Engineering from the National University of Singapore.
Presentation Title
Yield analysis by integrating Advanced Testing with Dynamic Fault Isolation
Presentation Abstract
As the semiconductor keeps developing, the product time-to-market becomes shorter and shorter. Production ramp up is facing a challenging situation to bring up the yield quickly. While the product becomes complicated, and more and more tough issues as a roadblock delay the yield improvement, especially for the functional failure, soft failure and so on. In this material, advanced failure analysis was introduced by combining the advance testing with the dynamic fault isolation to tackle the problem of functional failure mode. Together with example, different dynamic techniques and the respective application was introduced, including the software fault isolation of bitmapping and scan diagnosis, and hardware-based fault isolation of dynamic fault isolation, SDL (Soft Defect Localization) and LADA (Laser Assisted Device Alteration). This material is good reference for the similar advanced analysis.