Mr. Pax WANG

Pax Wang is currently the Technology Development Director of the Advanced Packaging Division at UMC, where he leads the strategic development of advanced packaging technologies, including 2.5D and 3D advanced packaging solutions. Since joining UMC in 2013, he has played a pivotal role in delivering key technology development projects, such as 14nm FinFET and 28nm eNVM. Prior to UMC, Pax worked at TSMC from 2010 to 2013, focusing on advanced FinFET platforms.

With over a decade of extensive experience in FEOL integration R&D and system-level marketing, and holding over 100 patents, Pax bridges front-end innovation with back-end packaging solutions to meet the evolving demands of AI and heterogeneous computing.

Presentation Title

Propelling AI Innovation with Advanced Packaging and Silicon Photonics

The generative AI revolution is driving an unprecedented demand for High-Performance Computing (HPC), ultra-fast data transmission, and highly efficient power management. As traditional scaling slows, Advanced Packaging and Silicon Photonics (SiPh) have emerged as the critical technologies to bridge the gap between chip capabilities and system-level performance.

This presentation explores the industry megatrends and outlines UMC’s comprehensive business strategy to address these challenges through a three-dimensional ""3E"" framework:

Expander: Leveraging robust advanced packaging solutions to expand UMC's memory and power/BCD businesses, optimizing energy efficiency for demanding AI workloads.

Enabler: Integrating a full spectrum of connectivity—from wireless (RF) to wired (SiPh) technologies—with advanced packaging to revolutionize data transmission and overcome critical I/O bandwidth bottlenecks.

Ecosystem: Forging strategic partnerships across the supply chain to provide comprehensive, end-to-end turnkey solutions.
Attendees will gain insights into how this strategic alignment empowers customers to accelerate time-to-market and secure a competitive edge in the rapidly evolving AI landscape.

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