Amkor Technology Malaysia Sdn. Bhd

Plan, coordinate and execute process capability control system and improvement.
Manage and effective monitoring of routine product and process quality and yield.
Plan, coordinate and execute quality and yield improvement activities.
Responsible to sustain equipment condition, Mean Time Between Assists/Failure (MTBA/F) including machine and process setup for existing product.
Responsible in capability improvement, cost down, parameter optimization projects and technical document writeup activity.
Able to manage & level up manpower technical skill.
Plan, coordinate and support process productivity and efficiency improvement activities.
Plan and execute efficient and effective analysis by employing best known methodologies.
Manage maverick lot system and lot disposition.
Prepare and manage in-process documents and documentation system.
Plan and do effective process and product related training.
Reporting and communication with customer with respect to product and process matter.
Support new product set up, low to high volume manufacturing.
Support and coordinate audits (internal and external).
Promote and lead creativity and innovation activities.

Possesses at least a Bachelors' / Masters' Degree in Engineering (Mechanical / Mechatronics / Manufacturing / Electrical & Electronics) or similar disciplines.
Minimum 3 years’ experience with Semiconductor knowledge in manufacturing / production, preferably in Die Attached / Clip Bond Process and equipment.
Experience in bringing a product from Low Volume to High Volume production.
To serve as a domain expert within the technical field.
Knowledge and experience in Lean Manufacturing, Six Sigma, RCA, DOE, SPC, 8D and Project Management would be an added advantage.
Knowledge and experience in Power device / QFN package / Flip chip assembly is desirable.

Senior Engineer, Equipment (Die Attach)