Amkor Technology Malaysia Sdn. Bhd

Handle abnormal lot disposition, decide on the failure analysis method, analyse the result & make judgments including establishing good communication with the customer on the lot proceeding to avoid quality risk for shipment.
Support process productivity and efficiency improvement activities.
Lead the team on internal or external auditing on responding to the relevant department, including coordinating with other department support for item closure.
Responsible for establishing, improve and maintaining manufacturing operational standard of operation (SOP) to reduce/ eliminate operation variation among the shift for better & stable manufacturing ability.
To manage Low Volume Manufacturing (LVM) for any new change introduced to the manufacturing line including preparation for the initial start to manage the risk of quality & manufacturability for the newly introduced item.
Responsible for leading improvement, maintaining Process Flow, Control Plan as well and FMEA which the input may come from risk management, improvement activities, claims, audit findings, or internal process.

Candidates should possess at least Masters / Bachelor’s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.
Minimum 5 years working experience as Process / Equipment Engineer in Semiconductor industry.
Strong technical skill in one or more of the following semiconductor manufacturing processes for LEADFRAME base (Soft Solder Die Attach, Ball Bonding (Au, Cu & Ag) , Al Wedge Bonding and EOL processes i.e. molding & package singulation for PQFN packages.
Good in critical thinking and systematic problem-solving skills e.g. DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bone, IS-IS NOT etc.
Familiar with the common equipment / technology in the industry and possess good knowhow of the equipment features for new package development.
Familiar with development of SIP packages (SIP-BGA/LGA etc.) as an added advantage.
Good written and verbal presentation skills. Able to present ideas, concepts, data, and plan with high confidence at team meetings and executive review meetings.

Senior Engineer, Process Development (Solder Wire / Wedge Bonding)