Amkor Technology Malaysia Sdn. Bhd

Managing execution of the new package development project according to business process guideline, to meet project milestone, quality & cost requirements.
Plan, organize and control the project with full responsibility for all operational decisions in the project.
Responsible for Engineering Samples, Qualification and safe launch builds, and proper hand over to manufacturing.
Break down the project complexity to transparently report the status of the project to project owner, upper management and diligently to customers.
Prepare respective business cases and forward-looking risk assessments timely to facilitate management decisions and consequence management.
Responsible to oversee customer audits and all issues related to the projects. Communicate effectively to gain support from all stakeholders.

Candidate should possess at least a Bachelor’s Degree or Master’s in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology / Material science) or equivalent.
Minimum 3 years working experience as Project Leader in Semiconductor Package Development.
Broad knowledge in overall Semiconductor FOL and EOL manufacturing processes.
Familiar with development of Power packages (PQFN, TOLL, LFPAK and etc) an added advantage.
Excellent Project Management, Organizational and Interpersonal Skills in managing semiconductor new package development project.
Ability to prioritize multiple activities and make effective decisions in support of a compact project plan, using sound communication skills, influencing power and negotiation skills both internally and externally with all stake holders.
Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor.

Senior Engineer / Engineer, Project Management (NPI)