Resonac Materials Malaysia Sdn. Bhd.
Job Title: R&D Engineer (Packaging Assembly)

Job Description/Content/Duties:

  • To perform machine set-up for wire bonder, die bonder and dicer machine.
  • To conduct functional validation and process development for pilot line assembly process
  • Involved in problem solving projects linked die attach and wire bonding processes, as well as internal quality issues.
  • Understand current standards in packaging processes and propose optimization, focusing in wire bonding and die attach operation.
  • Develop and maintain documentation for process and equipment, including standard operating procedures and work instructions.
  • Develop, verify and document wire bond and die bond processes for new package design.

Job Requirements:

  • Bachelor’s Degree in Electrical Engineering, Material Science, or related field.
  • At least 2 years working experience as wire bonder/die attach Engineer.
  • Strong data analytical skill, including proficiency method ie. FMEA, SPC, Six sigma
  • Ability to work collaboratively in a teamwork environment.
  • Mastery of Microsoft Office Application.
  • Good communication skills.

Additional Information:

Career Level: Executive
Years of Experience: At least 2 years working experience
Job Type: Permanent
Qualification: Bachelor's Degree and above 

Contact Point for the job:

Name: Ms. Ellen Wai
E-mail: [email protected]