Dr. Yik Yee Tan
Senior Market and Technology Analyst Yole Intelligence
Yik Yee Tan Ph.D. is in the packaging team within the Semiconductor, Memory and Computing Division at Yole Intelligence. Based in Malaysia, Yik Yee follows the semiconductor packaging industry and its evolution. Based on her technical expertise and market knowledge, she develops technology & market reports and is engaged in dedicated custom projects. Prior to Yole, Yik Yee Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at Onsemi (Malaysia). While at Onsemi, Yik Yee was deeply involved in numerous innovative advanced packaging projects. Yik Yee Tan holds a Ph.D. in Engineering Science from Multimedia University (MMU, Malaysia).
Presentation Title
Market and technology trends of Advanced Packaging
Presentation Abstract
Advanced packaging has been rapidly growing in recent years, driven by the increasing demand in high-performance computing, artificial intelligence, and autonomous driving. It is getting traction from semiconductor industry as more than Moore solution to enhance system performance to enable higher device performance, increase bandwidth, offer lower latency, and lower power consumption. This presentation will give an overview of the market and technology trend in the advanced packaging. Other than that, the presentation will highlight the emerging trend of chiplet and how it drives the advanced packaging to attain heterogeneous integration. Advanced packaging players and their innovation direction and commercial product will be briefly discussed. Last, the presentation will highlight important of IC substrate in advanced packaging supply chain of semiconductor.