Dr. Suresh Kumar SINGARAM
Head of Asian Technical Task Force Evatec SEA Pte Ltd
Dr Suresh has been in the semiconductor industry for more than 20 years working on various semiconductor packaging solutions. He currently leads a regional group in Evatec providing support for new technology transfer, software support as well advanced process support for Evatec customers. Dr Suresh graduated with a PhD in Plasma Physics from Nanyang Technological University Singapore.
Presentation Title
Addressing Key Challenges in Chiplet-Based Heterogeneous Integration
Abstract
Heterogeneous integration (HI) with chiplets offers a powerful path to boost system performance and functionality while pursuing cost-effective solutions. However, thermal bottlenecks and interconnect reliability can impede the full potential of chiplet-based designs. This presentation explores practical solutions to overcome these challenges, leveraging solutions from Evatec. We demonstrate the strategic use of backside metallization to significantly improve heat dissipation within chiplets, ensuring operational stability. Additionally, we highlight the benefits of Evatec's seed layer deposition solutions for improving contact resistance. These techniques enhance signal integrity, reduce power losses, and ultimately contribute to the creation of more efficient, reliable, and cost-effective HI systems.