Call for Presentations

Advanced Packaging & Heterogeneous Integration Summit

Day 0 | Monday, 4 May 2026 | 09:00 - 17:00
Day 1 | Tuesday, 5 May 2026 | 13:30 - 17:00

As system complexity increases and performance scaling extends beyond traditional Moore’s Law approaches, advanced packaging has become a critical enabler across computing, connectivity, and emerging applications.

This summit will feature four focused topics—Silicon Photonics, Panel-Level Packaging, Heterogeneous Integration, and Metrology—each addressing key technological, manufacturing, and ecosystem challenges across the advanced packaging value chain.

Silicon Photonics Read more

Recent advances in silicon photonics are rapidly moving the technology from research to early manufacturing, driven by rising demand for high-bandwidth, energy-efficient interconnects in AI, HPC, and data centers. Innovations in co-packaged optics, advanced modulators, and low-loss waveguides are enabling closer integration of photonics with leading-edge logic. At the same time, packaging approaches such as 2.5D interposers, chiplets, and optical I/O help overcome electrical limits and reduce power. Key challenges—alignment precision, thermal interactions, testing complexity, and supply-chain maturity—remain. This forum will explore how advanced packaging and cross-industry collaboration are paving the way for scalable silicon photonics deployment. 

Panel-Level Packaging Read more

Panel-level packaging (PLP) is emerging as a key inflection point in advanced packaging, delivering higher throughput, better cost efficiency, and broader adoption across semiconductor and electronics markets. PLP enables the industry’s expansion beyond leading-edge logic into automotive, industrial, and consumer applications. This forum will examine how fan-out, RDL-first, and embedded-die architectures are being scaled to large-format panels, along with the materials, equipment, and process innovations needed to manage warpage, uniformity, and yield. Ecosystem alignment across suppliers and standards bodies will be highlighted as essential to accelerating PLP industrialization. 

Heterogeneous Integration Read more

Heterogeneous integration is a central theme of SEMICON’s advanced packaging agenda, redefining how system performance and value are achieved in the post-Moore’s Law era. Rather than relying on monolithic scaling, the industry is increasingly adopting chiplet-based and multi-die architectures that combine logic, memory, RF, analog, and photonics within a single package. This forum will examine how advanced packaging technologies—such as interposers, advanced substrates, TSVs, and hybrid bonding—are enabling high-density interconnects, flexible design partitioning, and faster product innovation cycles. Key discussion areas include co-design methodologies, thermal and power integrity, testing strategies, and ecosystem standards. 

Metrology Read more

Metrology has become a critical enabler for advanced packaging as integration complexity, heterogeneous materials, and fine-pitch interconnects push beyond the limits of traditional measurement techniques. This forum will explore advancements in optical, e-beam, hybrid, and AI-assisted metrology that enable precise overlay control, defect detection, and in-line process monitoring for 2.5D, 3D, fan-out, and panel-level packaging. Emphasis will be placed on addressing challenges such as non-planar surfaces, tighter tolerances, and real-time data requirements. Cross-industry collaboration will be highlighted as essential for advancing metrology capabilities to support scalable, high-yield advanced packaging manufacturing. 

AI for Manufacturing Forum

Day 2 | Wednesday, 6 May 2026 | 09:00 - 17:00

The adoption of AI-driven solutions in manufacturing has been a key focus for semiconductor companies. With AI-powered automation, predictive analytics, and machine learning, these processes are evolving beyond efficiency gains to set industry benchmarks. AI-enabled smart manufacturing is now extending beyond the factory floor, transforming facilities into fully integrated AI-powered enterprises. With advanced computing and analytics, organizations can anticipate market shifts, optimize decision-making in real time, and autonomously adapt to changing business landscapes.

This forum will explore how AI enhances productivity, innovation, and scalability; whether predicting customer preferences, optimizing supply chains, enhancing R&D, or enabling real-time production adjustments, reshaping how businesses evolve, compete and grow.

AI for Product Testing Forum

Day 2 | Wednesday, 6 May 2026 | 09:00 - 17:00

Artificial intelligence is transforming IC testing by enabling smarter, faster, and more cost-effective solutions. From AI-driven fault detection and diagnosis to predictive analytics for yield improvement, these advancements address the growing complexity of modern integrated circuits. By automating test processes and enhancing accuracy, AI-powered testing accelerates time-to-market while reducing costs. This forum explores the latest innovations and applications of AI in reshaping the future of IC testing.

Semiconductor Climate Consortium and Energy Collaborative Summit: Energy, Emission & Efficiency

Day 3 | Thursday, 7 May 2026 | 09:00 - 17:00

As the semiconductor industry in Southeast Asia expands, sustainability is increasingly a near-term operational and strategic priority. This Sustainability Summit brings together industry leaders, sustainability experts, and policymakers to address the practical pathways for decarbonisation and responsible growth across the region.

Energy - The session will provide a clear view of how Southeast Asia’s semiconductor ecosystem can collectively address energy constraints, scale renewable energy solutions, foster a competitive renewable energy market, and build a resilient, low-carbon power foundation, while identifying clear decarbonization pathways and effective public–private partnership models.

Emissions - this session will focus on exploring the semiconductor industry's decarbonization pathway through the effective management of Scope 1, 2, and 3 emissions, improving data transparency, and aligning measurement and reporting with evolving regulatory and customer expectations.

Efficiency - this session will highlight how process optimisation, equipment innovation, and AI-enabled analytics can drive productivity gains while reducing energy intensity across fabs and supply chains.

Cybersecurity Forum @ TECHStage North

Day 3 | Thursday, 7 May 2026 | 09:00 - 12:00

Cybersecurity has become a critical priority for semiconductor manufacturing as advanced attacks increasingly target fabs, equipment, and global supply chains. Recent trends include zero‑day exploits on manufacturing systems—such as ICS and lithography tools—that enable IP theft and production disruptions. The rise of Industry 4.0 connectivity and deeper OT–IT integration further amplifies exposure to ransomware, phishing, and supply‑chain intrusions. This forum will examine emerging threats, the latest cybersecurity technologies, industry standards, risk‑assessment methodologies, and best practices—including SEMI cybersecurity standards and the Standardized Semiconductor Cybersecurity Assessment (SSCA)—to strengthen resilience across the semiconductor ecosystem.

This forum will be followed by a Cybersecurity Workshop (Fees applicable, more details coming soon).