Forum Tracks

Join our industry leaders at the CEO Summit as they share their insights on the theme, "Stronger Together – Collaborating to Navigate Uncertainties and Fostering Resilience".

As Southeast Asia’s electronics sector evolves, collaboration is more critical than ever. In the face of challenges such as economic instability, regulatory shifts, and geopolitical tensions, it is crucial for industry players to recognize that working together is essential for navigating uncertainties and building lasting resilience. Stakeholders must prioritize collective interests, build strategic partnerships, and exchange expertise to overcome shared challenges. By embracing collaboration, the industry can strengthen its competitive edge, foster innovation, and create a sustainable ecosystem built on unity and mutual support.

*Program subject to changes

Artificial intelligence is revolutionizing chip design by automating complex processes, optimizing performance, and accelerating time-to-market. From advanced algorithms for circuit optimization to AI-driven solutions for design verification and layout, these innovations are shaping the future of semiconductor development. Join researchers, engineers, and industry leaders to explore cutting-edge AI applications in chip design and their transformative impact on efficiency, cost, and scalability.

*Program subject to changes

"Future-Ready HR for Workplace 2030".

This forum explores the transformative role of AI in the semiconductor industry, both as a driver of innovation and as a tool for enhancing HR productivity. We will examine how AI is being adopted within HR to optimize processes across the full spectrum of work. Beyond technology, the forum emphasizes the critical synergy between HR teams and business leaders in cultivating human assets, driving growth, and achieving business outcomes. Join us for engaging discussions, including insights from business leaders on shaping the Workplace in 2030.

*Program subject to changes

As the demand for workers in the semiconductor industry continues to rise, it is crucial to bolster the talent pipeline. The forum places special emphasis on two key themes: "Revolutionizing HRM in the new Era" and "Transforming through Technology and Transitioning Generations".

*Program subject to changes

Explore the cutting-edge advancements transforming the semiconductor industry at the Advanced Packaging and Heterogeneous Integration Summit. This event focuses on innovative packaging solutions for chiplet integration and the expanding opportunities in silicon photonics.

Bringing together speakers from across the value chain—materials, equipment, design, packaging, and end-users—it offers a holistic view of the innovations driving performance, power efficiency, and scalability. Key topics include advanced packaging architectures, heterogeneous integration strategies, advanced packaging techniques like fan-out panel-level packaging (FOPLP) and Co-Packaged Optics (CPO) in emerging application such as silicon photonics for data centers and telecommunications.

Engage in thought-provoking discussions, gain valuable insights into industry challenges and solutions, and connect with key players shaping the future of semiconductor technologies. Join us at the summit to discover how advanced packaging and heterogeneous integration are unlocking the potential of tomorrow’s innovations.

*Program subject to changes

The adoption of AI-driven solutions in manufacturing has been a key focus for semiconductor companies. With AI-powered automation, predictive analytics, and machine learning, these processes are evolving beyond efficiency gains to set industry benchmarks. AI-enabled smart manufacturing is now extending beyond the factory floor, transforming facilities into fully integrated AI-powered enterprises. With advanced computing and analytics, organizations can anticipate market shifts, optimize decision-making in real time, and autonomously adapt to changing business landscapes.

This forum will explore how AI enhances productivity, innovation, and scalability; whether predicting customer preferences, optimizing supply chains, enhancing R&D, or enabling real-time production adjustments, reshaping how businesses evolve, compete and grow.

*Program subject to changes

Artificial intelligence is transforming IC testing by enabling smarter, faster, and more cost-effective solutions. From AI-driven fault detection and diagnosis to predictive analytics for yield improvement, these advancements address the growing complexity of modern integrated circuits. By automating test processes and enhancing accuracy, AI-powered testing accelerates time-to-market while reducing costs. This forum explores the latest innovations and applications of AI in reshaping the future of IC testing.

*Program subject to changes

The convergence of digital health, AI, digital therapeutics, advanced sensors, wearable technology, robotics, and data analytics is revolutionizing patient care, diagnostics, and treatment. These cutting-edge innovations are enhancing healthcare efficiency, accessibility, and outcomes.

This forum will explore collaborative opportunities in MedTech, not only to drive innovation but also to address industry pain points and challenges collectively. By bringing together experts, thought leaders, and stakeholders, it provides a platform to exchange knowledge, develop solutions, and inspire breakthroughs that will shape the future of healthcare.

*Program subject to changes