Mr. Lee Kam Heng - Chairman

Kam Heng Lee is the vice president and general manager of Malaysia Manufacturing Product Engineering and Volume Product Engineering at Intel Corporation. Lee manages the global High-Volume Engineering with groups in Malaysia, China, Vietnam and Costa Rica. Lee also serve as General Manager of Malaysia Volume Lab Engineering and Manufacturing Product Engineering at the Malaysia site. The team develops and delivers competitive product manufacturing test solutions across a wide range of products.

Lee first joined Intel in 1995 and has held a successful career in technology development and product engineering. Prior to his current role, Lee was director of New Product Integration in Assembly Test Manufacturing (ATM), where he was responsible for new product integration, new process technology deployment, A/T process yield integration, and A/T OpX in the ATM factories network. Earlier in his career at Intel, Lee held the position of Malaysia site director for Assembly Test Technology Development. In this role, Lee was chartered to develop test technologies to support future Intel products.