Conference Proceedings
Thank you for attending the CxO Summit and Technical Forums at SEMICON Southeast Asia 2022. Please find the approved presentation materials below. Do note that only materials that are approved by the speakers for distribution are shared.
Some materials are password-protected. To view the file, please key in the password that was provided to you upon the submission of the delegate survey for the respective forums.
If you require further assistance, please email [email protected] / [email protected].
CxO Summit
Fostering Sustainability, Supply Chain Stability and Industry Growth in Southeast Asia
Mr. Ajit MANOCHA, CEO & President, SEMI Global, United States
Building Resiliency & Sustainability in Semiconductor Industry
Mr. KC ANG, Chairman, SEMI SEA Regional Advisory Board, Senior Vice President of Global Fab Operations, GlobalFoundries, Singapore
Advocating a Sustainable Supply Chain in the New Age of Digitalization
Mr. Chan Pin CHONG, Vice-Chairman of SEMI SEA Regional Advisory Board and Smart Manufacturing, Executive Vice President & General Manager, Product & Solutions, Kulicke & Soffa, Singapore
Optical Solutions in Digitization and Smart Living
Mr. Glen BROWNLIE, Vice President, Malaysian Operations, ams-OSRAM, Malaysia
Market & Industry Trends
SEMI Market Outlook – Fab Investments, Equipment and Materials Forecast
Mr. Sanjay MALHOTRA, Vice President, Corporate Marketing and MIT, SEMI Global, United States
Strategies to Lead in the Semiconductor World
Mr. Bo HUANG, Expert Associate Partner, McKinsey & Company, Singapore
Global Semiconductor Industry Outlook
Mr. Hwee Chuan LOY, Executive Director, Media & Technology, Institutional Banking Group, DBS Bank, Singapore
Power of Geography: India in Semiconductor Manufacturing
Mr. Raja MANICKAM, CEO, Tata Electronics, OSAT, India
SMART Enterprise Forum
SSEA22_SMART_K&S_Chan Pin CHONG (PROTECTED)_0.pdf
Intelligence, Digital Twin and Analytics for the Smart Factory
Mr. Chan Pin CHONG, Vice-Chairman of SEMI SEA Regional Advisory Board and Smart Manufacturing, Executive Vice President & General Manager, Products & Solutions, Kulicke & Soffa, Singapore
5G is the Gateway to Smart Enterprises and Industries
Mr. ST LIEW, Vice President and President of Qualcomm Taiwan & South East Asia, Australia, New Zealand, Taiwan
For Enquiries, please email [email protected]
Think Forward: How to Transform an Electronics Manufacturing into A Digital Smart A.I. Factory?
Mr. Gary LEONG, Senior Director, Analytics Intelligence Solutions, Vitrox, Malaysia
Digital Twins in Manufacturing Industry
Mr. Andy PANG, Director, Solution Engineering, ASEAN, TIBCO Software Inc, Singapore
Power Beyond Silicon: WBG Semiconductors Technologies
Dr. Raj KUMAR, Vice President, Technology and Research & Development, Infineon Technologies (Kulim), Malaysia
Hyper-Edge Computing and Open Analytics Ecosystem for Heterogenous Package Testing Using AI and Machine Learning
Mr. Don ONG, Director and Head of Innovation, Advantest Field Service Group, Singapore
Advanced Packaging Forum
2.5D/3D Heterogenous Integration Driving Advanced Packaging Technology
Mr. Favier SHOO, Senior Manager, Strategic Marketing of Packaging Division, Applied Materials, Singapore
Thermo Compression Bonding and Advanced Packaging Trends
Mr. Samuel GOH, Senior Director, AP Product Marketing, Kulicke & Soffa, Singapore
Material Solutions to the Challenges in Heterogeneous Integration
Dr. Jie WU, Senior Manager, Application Engineering, Henkel, Singapore
Key Lithographic Materials Enabling High Density and Low-Loss Advanced Packaging
Dr. Koichi HASEGAWA, General Manager, JSR Corporation, Japan
Empowering Front-End Cellular Innovations with Advanced SiP Solutions
Mr. Glen SIEW, Director, R&D Strategic Roadmapping, Amkor Technology, Singapore
PVD Applications to Enable Heterogenous Integration
Dr. Suresh Kumar SINGARAM, Head of ATTF, Evatec SEA, Singapore
Challenges and Opportunities in Semiconductor Packaging
Mr. Andy NOAKES, Vice President, Packaging Channel, EPC Group, KLA Corporation, United Kingdom
Sustainability Forum
SEMI Sustainability Initiative - Meeting the Challenge
Mr. James AMANO, Senior Director, International Standards, SEMI Global, United States
Towards a Greener Future for Fabs
Ms. Dallal SLIMANI, Vice President Semiconductor Segment, Schneider Electric, Singapore
Playing Our Part in the Semiconductor Industry’s Response to Global Warming and Climate Change
Dr. Chris JONES, Environmental Solutions Business Development Manager, Edwards Vacuum, United Kingdom
Embarking on our Journey to Zero Carbon - Green Manufacturing for Fabs
Mr. HanBin LIM, APAC Regional Environmental Manager, GlobalFoundries, Singapore
Smarter and More Resilient Supply of Ultra High Purity NH4OH with Reduced Environmental Impact
Mr. Karl URQUHART, Director of R&D and Technology, DFS, an Exyte Group Company, USA
Advanced Product Testing Forum
Overcoming Test Challenges Arise from Heterogenous Integration
Mr. Douglas LAU, System Application Consultant, Advantest, Singapore
Test Flow Innovation Using AI & Machine Learning
Mr. Tze Hern KHOR, Senior Manager, Micron Test Solution Engineering, Singapore
Do More with Less – A More Accurate and Faster IV-CV Measurement Approach
Mr. Jesse LYLES, Vice President, Automated Validation, National Instruments, United States
Paradigm Shift in Testability and Diagnosis as Industry Moves to Heterogenous Product Integration
Mr. Terrence TAN, Senior Principal Engineer, Intel Microelectronics, Malaysia
High Parallelism Multisite Testing Challenges
Mr. Fairuz ZAKARIA, Principal Product Development Engineer, NXP, Malaysia