Advanced Packaging Forum

Theme: Heterogeneous Integration in the Era of More

Synopsis:

The Heterogeneous Integration roadmap released in 2019 has unveiled a long-term vision that addresses the challenges of shrinkage to a single-digit semiconductor technology node. The solution is to integrate different technology nodes using the innovation of Heterogenous Integration. This has also enabled the semiconductor industry to meet the ever-increasing demand for high-performance digital applications in this Era of More. In this forum, experts will share the industry trends and discuss technical challenges of design, material, equipment, and manufacturing techniques.

Forum Rate: SGD 155 / USD 115 

• Enjoy Group Discount at ADDITIONAL 15% off Early Bird Rate if you register 3 pax & above in any of the 5 Forums!

• Above rate quoted is inclusive of coffee/tea break & conference bento lunch & based on per pax per Forum.

• Malaysian Companies HRDF Claimable (Subject to T&C, Please refer to HRDF for more information)

Session Chair:    

     
     Ms. Lily KHOR
     Chairman of SEMI SEA Advanced Packaging
     Director of Research & Development, Amkor Technologies
     Malaysia

Session Co-Chair:    

     
     Dr. Juan Boon TAN
     Vice-Chairman of SEMI SEA Advanced Packaging
     Director, GlobalFoundries
     Singapore

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09:30 - 10:00   Guest Registration
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10:00 - 10:05    Welcome Remarks by Session Chair
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10:05 - 10:30     Flash Packaging - Emerging Trends and Integration Challenges

     Mr.Nirbhaya PATHAK
     Senior Director, Packaging Technology Development & Integration, Western Digital Storage
     Malaysia
     

                       
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10:30 - 10:55     2.5D/3D Heterogenous Integration Driving Advanced Packaging Technology

     Mr. Favier SHOO
     Senior Manager, Strategic Marketing of Packaging Division, Applied Materials
     Singapore

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10:55 - 11:10      Break & Networking
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11:10 - 11:35      Thermo Compression Bonding and Advanced Packaging Trends

     Mr. Samuel GOH
     Senior Director, AP Product Marketing, Kulicke & Soffa 
     Singapore

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11:35 - 12:00      Material Solutions to the Challenges in Heterogeneous Integration

    Dr. Jie WU
    Senior Manager Application Engineering, Henkel
    Singapore

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12:00 - 12:25     Innovative Equipment Solutions in New Era of Heterogeneous Integration

     Mr. Chee Ping LEE
     Technical Director, Lam Research
     Singapore

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12:25 - 13:25     Lunch & Networking
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13:25 - 13:30     Introduction by Session Co-Chair
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13:30 - 13:55    Leading Methodologies Provide the Foundational Building Blocks Across the Industry for the
                        Continued Growth and Expansion Over the Next Decade

     Mr. Hem TAKIAR
     Corporate Vice President, Package Development & Engineering, Micron Technology, Inc.
     United States




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13:55 - 14:20    Key Lithographic Materials Enabling High Density and Low-Loss Advanced Packaging

     Dr. Koichi HASEGAWA
     General Manager, JSR Corporation
     Japan

   

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14:20 - 14:45     Empowering Front-End Cellular Innovations with Advanced SiP Solutions

      Mr. Glen SIEW
      Director, R&D Strategic Roadmapping, Amkor Technology
      Singapore  

 

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14:45 - 15:10     PVD Applications to Enable Heterogenous Integration

     Dr. Suresh Kumar SINGARAM
     Head of ATTF, Evatec SEA
     Singapore

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15:10 - 15:25     Break & Networking
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15:25 - 15:50       Novel Silicone Hotmelt Solutions for Microelectronics

      Mr. Duen Kai CHANG
      Senior Technical Service and Development Specialist, Dow Chemical Pacific
      Singapore

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15:50 - 16:15      Challenges and Opportunities in Semiconductor Packaging

        Mr. Andy NOAKES
        Vice President, Packaging Channel EPC Group, KLA Corporation
        United Kingdom

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16:15 - 16:20     Lucky Draw and Closing Remarks by Session Chair         
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*Agenda subjected to further changes without prior notice.