Mr. Allen CHEAH

Allen Cheah is now serving as AT&S Malaysia Director of Applications / NSS. Before working with AT&S in Kulim, he graduated in the U.S. from both Mechanical and Electrical faculties and had worked mainly in both R&D and Development Engineering fields for 25+ years  specializing in FEOL Lithography Tooling (ASML), Microelectronics, HSIO PCB, Mechanical Systems, Embedded Software/Firmware Design, Test Development and EME System Rack.

Further he is now involved in R&D Integration readiness to support Advanced Heterogeneous Integration for Multiple Chiplets into a Single Advance Packaging Substrates for AI HPU Chip with the NPU/GPU, Memory Controller, HBM modules, CPO & etc. Currently, he sits as a Core Member for Malaysia’s NSS (National Semiconductor Strategy) Advanced Packaging Cluster (AP Cluster), as well as, Automation & Testing Equipment Cluster (ATEC Cluster) to drive the perennial objectives of charting the National Vision, Framework and Technology Envelope for long term spurious growth in Advanced Packaging SIP (System in Package) readiness for Heterogeneous Integration of Multiple Chiplets for both 2.5D and 3D SIP integrations within CREST NSS, Khazanah NSS, MSIA, MITI/MIDA, REFSA, IPC, etc. Hence, he is imbued with multi-physics knowledge for his foray with Semicap Advanced Packaging, Big Metals Equipments for Microelectronics, Top Tier HPU, Big Data, AI and IoTG companies for his continuous career & growth journey.

Presentation Title:
Meeting AI Challenges-Large Package Solution and Warpage Management for Advance Substrates

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