Mr. Chee Ping LEE

Lee Chee Ping is a Managing Director at Lam Research, with over 20 years of expertise in the semiconductor industry, specifically focusing on advanced packaging and heterogeneous integration. He has led global field packaging process teams, collaborating extensively with clients on the development and qualification of 2D, 2.5D, and 3D technologies. Lee Chee Ping actively engages with the microelectronics supply chain, fostering meaningful exchanges with fabless entities, IDMs, OSATs, and equipment/material suppliers globally.

His profound knowledge of the industry positions him to oversee comprehensive market analysis and technology trend mapping for advanced packaging in Lam Research, as part of efforts to develop next generation innovations. Additionally, he spearheads the technical marketing efforts for Lam's wafer and panel-level equipment solutions. Lee Chee Ping's insights have been shared at various prestigious advanced semiconductor packaging conferences.

Presentation Title

Packaging the Future: How Equipment Advancements are Enabling Heterogeneous Integration

Abstract

The advancements in equipment technology are revolutionizing heterogeneous integration, enabling more efficient and powerful semiconductor devices. This presentation session will highlight how Lam Research's cutting-edge equipment is driving the integration of diverse components into a single system. By leveraging these innovations, manufacturers can achieve higher performance, power efficiency, and miniaturization, essential for modern applications like AI, high-performance computing, and mobile devices. Integrating different types of chips into one package allows for more complex and capable systems, shaping the future of semiconductor technology.

The session will also focus on specific equipment advancements from Lam Research, such as panel-level packaging, hybrid bonding and advanced interconnect technologies. The discussion will emphasize the importance of Lam Research's equipment in enabling next-generation semiconductor devices, providing insights into future trends and challenges. This presentation aims to offer valuable insights for researchers, engineers, and industry professionals.

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