Mr. David GANI

David Gani is Director of Packaging R&D, based in Singapore. He has been with ST for 20 years. He is currently leading a packaging R&D team located in Singapore and Taiwan. His team provides packaging solution aligned with product functionality and product groups needs. He is also defining future packaging strategy and roadmap, especially for Chip Scale Packaging technology, ensuring state of the art packaging solution for ST. David has also contributed to more than 20 US patents.

Prior to ST, David worked as a process engineer at PT Unisem Batam. He had graduated from Gadjah Mada University in Indonesia, holding a degree in Mechanical Engineering. In his free time, he is an avid badminton player and a dedicated family man.

Presentation Title
Panel Level Packaging: Challenges and Advantages in Packaging R&D and High-Volume Production

Abstract
Panel level packaging continue to gain momentum, driven by cost and growth in heterogenous packaging integration, where using conventional wafer size packaging approach, we see more and more constraints and limitation.

STMicroelectronics already run-in high-volume production of panel level packaging since early 2023.

The presentation will share the benefits and challenges in package R&D and industrialization of panel level packaging, based on 2 years high volume production.

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