Dr. BJ HAN - Keynote Speaker

Dr. Byung Joon (BJ) Han is the CEO and co-founder of Silicon Box, working on the forefront of semiconductor interconnection technologies. Previously, he served as Chairman & CEO of STATS ChipPAC. Dr. Han holds over 300 patents in semiconductor packaging and is credited with developing widely used packaging technologies like QFN, FBGA, and FOWLP.

In 2025, he was awarded the Leonardo International Prize for significant contributions to Italy's technological landscape. In 2024, he was recognized as one of Asia’s Most Influential figures by Tatler Magazine for his contributions to Singapore’s technology sector. He received his PhD from Columbia University and attended Harvard Business School.

Presentation Title
Emergence of Chiplet and New Era of Advanced Packaging

Abstract
The semiconductor industry is experiencing a significant transformation as chiplet architectures and advanced packaging technologies redefine the limits of system integration, performance, and scalability. Dr. Han’s opening keynote will provide an overview of the progress and challenges in current semiconductor manufacturing. His presentation will focus on how chiplets are becoming a key solution for high-power technologies, particularly in the field of AI. Dr. Han will discuss the challenges of heterogeneous integration, including interoperability, design for performance, adoption of IPs, communication standards, device reliability, and cost realization. Additionally, he will explore solutions that could accelerate the adoption of chiplet technology, marking the beginning of a new era in advanced packaging.

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